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科研机构
华南理工大学 [18]
内容类型
会议论文 [13]
期刊论文 [4]
会议 [1]
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2016 [1]
2014 [1]
2013 [1]
2012 [1]
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专题:华南理工大学
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Black carbon aerosols at Mt. Muztagh Ata, a high-altitude location in the Western Tibetan Plateau (EI收录)
期刊论文
Aerosol and Air Quality Research, 2016, 卷号: 16, 页码: 752-763
作者:
Zhu, Chong-Shu[1,2]
;
Cao, Jun-Ji[1,2,5]
;
Xu, Bai-Qing[3]
;
Huang, Ru-Jin[1,2]
;
Wang, Ping[1,7]
收藏
  |  
浏览/下载:17/0
  |  
提交时间:2019/04/24
Aerosols
Atmospheric aerosols
Fog
Characterization and seasonal variations of levoglucosan in fine particulate matter in Xi’an, China (EI收录SCI收录)
期刊论文
Journal of the Air and Waste Management Association, 2014, 卷号: 64, 页码: 1317-1327
作者:
Zhang, Ting[1,2]
;
Cao, Jun-Ji[1,2]
;
Chow, Judith C.[1,3]
;
Shen, Zhen-Xing[1,4]
;
Ho, Kin-Fai[5]
收藏
  |  
浏览/下载:7/0
  |  
提交时间:2019/04/25
Biomass
Combustion
Organic carbon
Abundance, composition and source of atmospheric PM2.5 at a remote site in the Tibetan Plateau, China
期刊论文
TELLUS SERIES B-CHEMICAL AND PHYSICAL METEOROLOGY, 2013, 卷号: 65
作者:
Li, Jian Jun[1]
;
Wang, Ge Hui[1]
;
Wang, Xin Ming[2]
;
Cao, Jun Ji[1]
;
Sun, Tao[1]
收藏
  |  
浏览/下载:5/0
  |  
提交时间:2019/04/25
fine particles
inorganic ions
biogenic secondary organic aerosols
relative humidity
Opportunistic relaying strategy for prolonging network lifetime based on power weighting (EI收录)
期刊论文
Huanan Ligong Daxue Xuebao/Journal of South China University of Technology (Natural Science), 2012, 卷号: 40, 页码: 37-42
作者:
Ke, Feng[1]
;
Geng, Heng-Xin[1]
;
Feng, Sui-Li[1]
;
Jiang, Ming[2]
收藏
  |  
浏览/下载:9/0
  |  
提交时间:2019/04/26
Decoding
Energy utilization
Power control
Relay control systems
Stress-Induced Phosphoprotein 1 (STIP1) Promotes Tumorigenesis and Predicts Poor Survival in Gastric Carcinoma Through Induction of the Phosp (CPCI-S收录)
会议
作者:
He, Xin
;
Peng, Sui
;
Zai, Ertao
;
Cai, Shirong
;
Lin, Yi
收藏
  |  
浏览/下载:2/0
  |  
提交时间:2019/04/11
Undercooling and Solidification Behavior of Sn-Ag-Cu Solder Balls and Sn-Ag-Cu/UBM Joints (CPCI-S收录)
会议论文
2013 14TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT)
作者:
Xu, Guang-Sui[1]
;
Zeng, Jing-Bo[1]
;
Zhou, Min-Bo[1]
;
Zhang, Xin-Ping[1]
收藏
  |  
浏览/下载:2/0
  |  
提交时间:2019/04/15
undercooling
solidification
cooling rate
Sn-Ag-Cu solder ball
Cu/Ni UBM
Volume effect on interfacial microstructure and mechanical properties of Ni(UBM)/Sn3.0Ag0.5Cu/Ni(UBM) joints (CPCI-S收录EI收录)
会议论文
14th International Conference on Electronic Materials and Packaging, EMAP 2012, Lantau Island, Hong kong, December 13, 2012 - December 16, 2012
作者:
Zeng, Jing-Bo[1]
;
Xu, Guang-Sui[1]
;
Zhou, Min-Bo[1]
;
Zhang, Xin-Ping[1]
收藏
  |  
浏览/下载:7/0
  |  
提交时间:2019/04/15
Brittle fracture
Brittleness
Failure modes
Morphology
Nickel
Tensile strength
Microstructural Evolution and Mechanical Behavior of Line-type Ni/Sn3.0Ag0.5Cu/Ni Interconnects with a Small Thickness during Isothermal Agin (CPCI-S收录)
会议论文
2012 13TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY & HIGH DENSITY PACKAGING (ICEPT-HDP 2012)
作者:
Zeng, Jing-Bo[1]
;
Xu, Guang-Sui[1]
;
Zhou, Min-Bo[1]
;
Ma, Xiao[1]
;
Zhang, Xin-Ping[1]
收藏
  |  
浏览/下载:1/0
  |  
提交时间:2019/04/15
Undercooling and solidification behavior of Sn-Ag-Cu solder balls and Sn-Ag-Cu/UBM joints (EI收录)
会议论文
Proceedings - 2013 14th International Conference on Electronic Packaging Technology, ICEPT 2013, Dalian, China, August 11, 2013 - August 14, 2013
作者:
Xu, Guang-Sui[1]
;
Zeng, Jing-Bo[1]
;
Zhou, Min-Bo[1]
;
Zhang, Xin-Ping[1]
收藏
  |  
浏览/下载:5/0
  |  
提交时间:2019/04/15
Cooling
Electronics packaging
Silver
Soldering
Soldering alloys
Solidification
Undercooling
Influence of Soldering Temperature and Dwelling Time on Morphological Evolution of CU6Sn5 Intermetallic Compound at the Sn-3.0Ag-0.5Cu/Cu Int (CPCI-S收录)
会议论文
2012 13TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY & HIGH DENSITY PACKAGING (ICEPT-HDP 2012)
作者:
Xu, Guang-Sui[1]
;
Zeng, Jing-Bo[1]
;
Zhou, Min-Bo[1]
;
Cao, Shan-Shan[1]
;
Ma, Xiao[1]
收藏
  |  
浏览/下载:1/0
  |  
提交时间:2019/04/15
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