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	Volume effect on interfacial microstructure and mechanical properties of Ni(UBM)/Sn3.0Ag0.5Cu/Ni(UBM) joints (CPCI-S收录EI收录)
	Zeng, Jing-Bo[1]; Xu, Guang-Sui[1]; Zhou, Min-Bo[1]; Zhang, Xin-Ping[1]
会议名称	14th International Conference on Electronic Materials and Packaging, EMAP 2012
会议日期	December 13, 2012 - December 16, 2012
会议地点	Lantau Island, Hong kong
关键词	Brittle fracture Brittleness Failure modes Morphology Nickel Tensile strength
URL标识	查看原文
内容类型	会议论文
URI标识	http://www.corc.org.cn/handle/1471x/2053856
专题	华南理工大学
作者单位	[1] Smart Materials and Electronic Packaging [SMEP], School of Materials Science and Engineering, South China University of Technology, Guangzhou 510640, China
推荐引用方式 GB/T 7714	Zeng, Jing-Bo[1],Xu, Guang-Sui[1],Zhou, Min-Bo[1],等. Volume effect on interfacial microstructure and mechanical properties of Ni(UBM)/Sn3.0Ag0.5Cu/Ni(UBM) joints (CPCI-S收录EI收录)[C]. 见:14th International Conference on Electronic Materials and Packaging, EMAP 2012. Lantau Island, Hong kong. December 13, 2012 - December 16, 2012.

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