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Wafer-Level Package With Simultaneous TSV Connection and Cavity Hermetic Sealing by Solder Bonding for MEMS Device 期刊论文
IEEE TRANSACTIONS ON ELECTRONICS PACKAGING MANUFACTURING, 2009, 卷号: 32, 期号: 3, 页码: 125-132
Cao, YH; Ning, WG; Luo, L
收藏  |  浏览/下载:18/0  |  提交时间:2012/03/24
Wafer-Level Package With Simultaneous TSV Connection and Cavity Hermetic Sealing by Solder Bonding for MEMS Device 期刊论文
IEEE TRANSACTIONS ON ELECTRONICS PACKAGING MANUFACTURING, 2009, 卷号: 32, 期号: 3 Pages, 页码: 125-132
Cao, YH; Ning, WG; Luo, L
收藏  |  浏览/下载:8/0  |  提交时间:2012/05/12
Strong green electroluminescence from silicon based oxide films 期刊论文
SURFACE & COATINGS TECHNOLOGY, 2002, 卷号: 154, 期号: 1, 页码: 82-87
Wu, XM; Zhuge, LJ; Tang, NY; Ye, CN; Ning, ZY; Yao, WG; Dong, YM; Yu, YH
收藏  |  浏览/下载:15/0  |  提交时间:2012/03/24
Room-temperature visible electroluminescence of Al-doped silicon oxide films 期刊论文
APPLIED PHYSICS LETTERS, 2001, 卷号: 78, 期号: 26, 页码: 4121-4123
Wu, XM; Dong, YM; Zhuge, LJ; Ye, CN; Tang, NY; Ning, ZY; Yao, WG; Yu, YH
收藏  |  浏览/下载:12/0  |  提交时间:2012/03/24
Influence of Al-doping on electroluminescence of silicon-based films 期刊论文
CHINESE SCIENCE BULLETIN, 2001, 卷号: 46, 期号: 24, 页码: 2043-2045
Wu, XM; Ye, CN; Zhuge, LJ; Dong, YM; Tang, NY; Yu, YH; Ning, ZY; Yao, WG
收藏  |  浏览/下载:12/0  |  提交时间:2012/03/24


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