Wafer-Level Package With Simultaneous TSV Connection and Cavity Hermetic Sealing by Solder Bonding for MEMS Device

	Wafer-Level Package With Simultaneous TSV Connection and Cavity Hermetic Sealing by Solder Bonding for MEMS Device
	Cao, YH ; Ning, WG ; Luo, L
刊名	IEEE TRANSACTIONS ON ELECTRONICS PACKAGING MANUFACTURING
	2009
卷号	32 期号:3 页码:125-132
关键词	EUTECTIC SNPB CU-SN COPPER
ISSN号	1521-334X
通讯作者	Cao, YH, Chinese Acad Sci, Shanghai Inst Microsyst & Informat Technol, State Key Labs Transducer Technol, Shanghai 200050, Peoples R China
学科主题	Engineering, Manufacturing
收录类别	SCI
语种	英语
公开日期	2012-03-24
内容类型	期刊论文
源URL	[http://ir.sim.ac.cn/handle/331004/94773]
专题	上海微系统与信息技术研究所_功能材料与器件_期刊论文
推荐引用方式 GB/T 7714	Cao, YH,Ning, WG,Luo, L. Wafer-Level Package With Simultaneous TSV Connection and Cavity Hermetic Sealing by Solder Bonding for MEMS Device[J]. IEEE TRANSACTIONS ON ELECTRONICS PACKAGING MANUFACTURING,2009,32(3):125-132.
APA	Cao, YH,Ning, WG,&Luo, L.(2009).Wafer-Level Package With Simultaneous TSV Connection and Cavity Hermetic Sealing by Solder Bonding for MEMS Device.IEEE TRANSACTIONS ON ELECTRONICS PACKAGING MANUFACTURING,32(3),125-132.
MLA	Cao, YH,et al."Wafer-Level Package With Simultaneous TSV Connection and Cavity Hermetic Sealing by Solder Bonding for MEMS Device".IEEE TRANSACTIONS ON ELECTRONICS PACKAGING MANUFACTURING 32.3(2009):125-132.