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浏览/检索结果: 共21条，第1-10条 帮助 限定条件 专题：深圳先进技术研究院    第一署名单位    第一作者单位    通讯作者单位     已选(0)清除 条数/页：5101520253035404550556065707580859095100   排序方式：请选择作者升序作者降序题名升序题名降序发表日期升序发表日期降序提交时间升序提交时间降序 Tailored surface chemistry of SiO2 particles with improved rheological, thermal-mechanical and adhesive properties of epoxy based composites for underfill applications 期刊论文 POLYMER, 2018 作者:  Li, Gang;  He, Yachuan;  Zhu, Pengli;  Zhao, Tao;  Sun, Rong 收藏  |  浏览/下载：20/0  |  提交时间：2019/01/31 Study on the effects of interfacial interaction on the rheological and thermal performance of silica nanoparticles reinforced epoxy nanocomposites. 期刊论文 COMPOSITES PART B-ENGINEERING, 2017 作者:  Guo, Qian;  Zhu, Pengli;  Li, Gang;  Wen, Junjie;  Wang, Tianyu 收藏  |  浏览/下载：21/0  |  提交时间：2018/02/02 Surface modification of nano-size SiO2 filler for flip chip underfill applications 会议论文 Harbin 作者:  Gang Li;  yachuan He;  Pengli Zhu;  Tao Zhao;  Rong Sun 收藏  |  浏览/下载：36/0  |  提交时间：2018/02/02 Improvements in thermo-mechanical and rheological properties of SiO2/epoxy composites using different types of SiO2 期刊论文 JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2016 作者:  Gang Li;  Wenjie Zhang;  Pengli Zhu;  Daoqiang Lu;  Tao Zhao 收藏  |  浏览/下载：20/0  |  提交时间：2017/01/13 Cure kinetics study of a Novel Die Attach Adhesive for High Power Light-Emitting Diode 会议论文 China Semiconductor Technology International Conference 2016, CSTIC 2016, Shanghai, China 作者:  Baotan Zhang;  Rong Sun;  Yankang Han;  Pengli Zhu;  Daoqiang(Daniel) Lu 收藏  |  浏览/下载：28/0  |  提交时间：2017/01/15 Low cost and highly conductive elastic composites for flexible and printable electronics 期刊论文 JOURNAL OF MATERIALS CHEMISTRY C, 2016 作者:  Hu, Yougen;  Zhao, Tao;  Zhu, Pengli;  Zhu, Yu;  Shuai, Xingtian 收藏  |  浏览/下载：27/0  |  提交时间：2017/01/13 Comparative study of anhydride-based and amine-based underfill materials for flip chip applications 会议论文 China Semiconductor Technology International Conference 2016, CSTIC 2016, Shanghai, China 作者:  Gang Li;  Pengli Zhu;  Qian Guo;  Tao Zhao;  Daniel Lu 收藏  |  浏览/下载：13/0  |  提交时间：2017/01/15 Underfill Technology for Fine Pitch Flip Chip Application 会议论文 The 17th International Conference on electronic packing Technology (ICEPT 2016), Changsha,China 作者:  Pengli Zhu;  Gang Li;  Qian Guo;  Tao Zhao;  Daoqiang Lu 收藏  |  浏览/下载：41/0  |  提交时间：2017/01/15 Insights into the role of interface in the rheological property of underfill composites 会议论文 China Semiconductor Technology International Conference 2016, CSTIC 2016, Shanghai, China 作者:  Qian Guo;  Pengli Zhu;  Junjie Wen;  Gang Li;  Tianyu Wang 收藏  |  浏览/下载：15/0  |  提交时间：2017/01/15 Mesoporous Silica Nanoparticles: A Potential Inorganic Filler To Prepare Polymer Composites With Low CTE And Low Modulus For Electronic Packaging Applications 会议论文 2016 IEEE 66TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC), Las Vegas, NV 作者:  Li, Gang;  Zhu, Pengli;  Zhao, Tao;  Sun, Rong;  Lu, Daoqiang 收藏  |  浏览/下载：23/0  |  提交时间：2017/01/15