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	Comparative study of anhydride-based and amine-based underfill materials for flip chip applications
	Gang Li; Pengli Zhu; Qian Guo; Tao Zhao; Daniel Lu; Rong Sun; Chingping Wong
	2016
会议名称	China Semiconductor Technology International Conference 2016, CSTIC 2016
会议地点	Shanghai, China
英文摘要	as hardeners in underfill materials for flip chip packaging. A comparison was made between these two systems in order to evaluate the comprehensive performance of the resulting underfill. It was found that the addition of multi-size silica particles has little effect on the curing reaction of the epoxy mixture while a significant effect on increasing the viscosity, storage modulus, Tg and lowering the CTE and the magnitude of the tanδ peak with the increase of SiO2 loading for both anhydride and amine curing system. Moreover, with the same filler loading, compared with the amine based underfill, the anhydride system exhibited much lower viscosity, glassy modulus, and CTE in the glassy region and lower Tg thus showing a potential for flip chip underfilling applications.
收录类别	EI
语种	英语
内容类型	会议论文
源URL	[http://ir.siat.ac.cn:8080/handle/172644/10100]
专题	深圳先进技术研究院_集成所
作者单位	2016
推荐引用方式 GB/T 7714	Gang Li,Pengli Zhu,Qian Guo,et al. Comparative study of anhydride-based and amine-based underfill materials for flip chip applications[C]. 见:China Semiconductor Technology International Conference 2016, CSTIC 2016. Shanghai, China.

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