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CORC

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Size effect on interface reaction of Sn-xCu/Cu solder joints during multiple reflows 期刊论文
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2019, 卷号: 30, 页码: 4359-4369
作者:  Huang, Ru;  Ma, Haoran;  Shang, Shengyan;  Kunwar, Anil;  Wang, Yunpeng
收藏  |  浏览/下载：26/0  |  提交时间：2019/12/02
Growth behavior of preferentially scalloped intermetallic compounds at extremely thin peripheral Sn/Cu interface 期刊论文
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2019, 卷号: 30, 页码: 2872-2887
作者:  Shang, Shengyan;  Kunwar, Anil;  Wang, Yanfeng;  Qu, Lin;  Ma, Haitao
收藏  |  浏览/下载：26/0  |  提交时间：2019/12/02
Geometrical Effects of Cu@Ag Core-Shell Nanoparticles Treated Flux on the Growth Behaviour of Intermetallics in Sn/Cu Solder Joints 期刊论文
ELECTRONIC MATERIALS LETTERS, 2019, 卷号: 15, 页码: 253-265
作者:  Shang, Shengyan;  Kunwar, Anil;  Wang, Yanfeng;  Yao, Jinye;  Wu, Yingchao
收藏  |  浏览/下载：29/0  |  提交时间：2019/12/02
Geometrical effects on growth kinetics of interfacial intermetallic compounds in Sn/Cu joints reflowed with Cu nanoparticles doped flux 期刊论文
THIN SOLID FILMS, 2019, 卷号: 669, 页码: 198-207
作者:  Shang, Shengyan;  Kunwar, Anil;  Yao, Jinye;  Ma, Haitao;  Wang, Yunpeng
收藏  |  浏览/下载：20/0  |  提交时间：2019/12/02
Field measurement and numerical simulation of the influence of blasting excavation on adjacent buried pipelines 期刊论文
International Journal of Critical Infrastructures, 2019, 卷号: 15, 页码: 70-89
作者:  Wang, Haitao;  Wu, Yuedong;  Jin, Hui;  Jia, Jinqing;  Wang, Kai
收藏  |  浏览/下载：16/0  |  提交时间：2019/12/02
Electrochemical migration behavior of Sn-based lead-free solder 期刊论文
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2019, 卷号: 30, 页码: 14695-14702
作者:  Qi, Xiao;  Ma, Haoran;  Wang, Chen;  Shang, Shengyan;  Li, Xiaogan
收藏  |  浏览/下载：13/0  |  提交时间：2019/12/02
Experimental study on the cavity dynamics of oblique impact of sphere on a viscous liquid floating on water 期刊论文
Ocean Engineering, 2019, 卷号: 194
作者:  Sun, Tiezhi;  Wang, Heng;  Zou, Li;  Zong, Zhi;  Li, Haitao
收藏  |  浏览/下载：2/0  |  提交时间：2019/12/02
Effects of TiO2 nanoparticles addition on physical and soldering properties of Sn-xTiO(2) composite solder 期刊论文
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2019, 卷号: 30, 页码: 18828-18837
作者:  Liu, Zhiyuan;  Ma, Haoran;  Shang, Shengyan;  Wang, Yunpeng;  Li, Xiaogan
收藏  |  浏览/下载：1/0  |  提交时间：2019/12/02
Effect of the TiO2 Nanoparticles on the Growth Behavior of Intermetallics in Sn/Cu Solder Joints 期刊论文
METALS AND MATERIALS INTERNATIONAL, 2019, 卷号: 25, 页码: 499-507
作者:  Shang, Shengyan;  Kunwar, Anil;  Yao, Jinye;  Wang, Yanfeng;  Ma, Haitao
收藏  |  浏览/下载：27/0  |  提交时间：2019/12/02
Enhancement of hardness of bulk solder by doping Cu nanoparticles at the interface of Sn/Cu solder joint 期刊论文
MICROELECTRONIC ENGINEERING, 2019, 卷号: 208, 页码: 47-53
作者:  Shang, Shengyan;  Wang, Yanfeng;  Wang, Yunpeng;  Ma, Haitao;  Kunwar, Anil
收藏  |  浏览/下载：121/0  |  提交时间：2019/12/02

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