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	Enhancement of hardness of bulk solder by doping Cu nanoparticles at the interface of Sn/Cu solder joint
	Shang, Shengyan; Wang, Yanfeng; Wang, Yunpeng; Ma, Haitao; Kunwar, Anil
刊名	MICROELECTRONIC ENGINEERING
	2019
卷号	208页码:47-53
关键词	Finite element analysis Intermetallics Hardness Soldering Scanning electron microscopy Nanoparticles
ISSN号	0167-9317
URL标识	查看原文
WOS记录号	[DB:DC_IDENTIFIER_WOSID]
内容类型	期刊论文
URI标识	http://www.corc.org.cn/handle/1471x/3225245
专题	大连理工大学
作者单位	1.Dalian Univ Technol, Sch Mat Sci & Engn, Dalian 116024, Peoples R China. 2.Dalian Univ Technol, Sch Mat Sci & Engn, Dalian 116024, Peoples R China. 3.Katholieke Univ Leuven, Dept Mat Engn, Kasteelpk Arenberg 44, B-3001 Leuven, Belgium.
推荐引用方式 GB/T 7714	Shang, Shengyan,Wang, Yanfeng,Wang, Yunpeng,et al. Enhancement of hardness of bulk solder by doping Cu nanoparticles at the interface of Sn/Cu solder joint[J]. MICROELECTRONIC ENGINEERING,2019,208:47-53.
APA	Shang, Shengyan,Wang, Yanfeng,Wang, Yunpeng,Ma, Haitao,&Kunwar, Anil.(2019).Enhancement of hardness of bulk solder by doping Cu nanoparticles at the interface of Sn/Cu solder joint.MICROELECTRONIC ENGINEERING,208,47-53.
MLA	Shang, Shengyan,et al."Enhancement of hardness of bulk solder by doping Cu nanoparticles at the interface of Sn/Cu solder joint".MICROELECTRONIC ENGINEERING 208(2019):47-53.

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