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浏览/检索结果: 共12条，第1-10条 帮助 限定条件 专题：兰州理工大学    第一署名单位    第一作者单位    通讯作者单位     已选(0)清除 条数/页：5101520253035404550556065707580859095100   排序方式：请选择作者升序作者降序题名升序题名降序发表日期升序发表日期降序提交时间升序提交时间降序 Study of the dynamic wetting behavior of Sn droplet impacting Cu substrate 期刊论文 APPLIED PHYSICS A-MATERIALS SCIENCE & PROCESSING, 2022, 卷号: 128, 期号: 8 作者:  Yu, Weiyuan;  Wang, Mingkang;  Wang, Fengfeng;  Wang, Xiwushan;  Wu, Baolei 收藏  |  浏览/下载：17/0  |  提交时间：2022/07/19 Droplet impaction  Droplet solidification  Dynamic wetting behavior  Thermal spraying  Jet formation   Study of microstructure and mechanical properties of Cu/In-45Cu/SiC joints connected by ultrasonic-assisted TLP 期刊论文 Microelectronics Reliability, 2022, 卷号: 135 作者:  Yu, Weiyuan;  Li, Binbin;  Wu, Baolei;  Wang, Fengfeng;  Wang, Mingkang 收藏  |  浏览/下载：18/0  |  提交时间：2022/08/09 Binary alloys  Copper  Copper alloys  Indium alloys  Lead-free solders  Microstructure  Shear flow  Silicon carbide  Soldering  Temperature  Thermoelectric equipment  Wide band gap semiconductors  Composite solders  Electronics devices  In-45cu composite solder paste  Intermetallics compounds  Microstructures and mechanical properties  Service temperature  Shears strength  Solderpaste  Ultrasonic action time  Ultrasonic-assisted TLP   Spreading behavior of Sn droplets impacting Cu and stainless steel substrates 期刊论文 SURFACES AND INTERFACES, 2022, 卷号: 29 作者:  Wang, Xiwushan;  Yu, Weiyuan;  Wang, Mingkang;  Wang, Fengfeng;  Wu, Baolei 收藏  |  浏览/下载：15/0  |  提交时间：2022/04/21 Metal droplets  Droplet impinging  Spreading  Droplet diameter  Contact angle   Effect of Ultrasonic Vibration Coupled with Direct Current on Wetting Behavior 期刊论文 Xiyou Jinshu Cailiao Yu Gongcheng/Rare Metal Materials and Engineering, 2022, 卷号: 51, 期号: 3, 页码: 800-805 作者:  Sun, Xuemin;  Yu, Weiyuan;  Wang, Fengfeng;  Wu, Baolei;  Wang, Yanhong 收藏  |  浏览/下载：21/0  |  提交时间：2022/06/20 Copper  Intermetallics  Nanocomposites  Precipitation (chemical)  Ultrasonic applications  Ultrasonic waves  Wetting  Cu substrate  Direct current method  Direct-current  Driving forces  Intermetallics compounds  Liquid solders  Power current  Ultrasonic-vibration  Wetting balance  Wetting behavior   Effect of Electric Field on the Microstructure and Properties of Brazed Joints of Float Glass and Kovar 4J29 期刊论文 RARE METAL MATERIALS AND ENGINEERING, 2021, 卷号: 50, 期号: 11, 页码: 4003-4009 作者:  Yu Weiyuan;  Yang Guoqing;  Sun Xuemin;  Wang Fengfeng;  Zhang Tao 收藏  |  浏览/下载：9/0  |  提交时间：2022/03/01 ALTSAB  anodic bonding  soldering  float glass  Kovar   Effect of ultrasonic vibration on the wetting behavior of molten tin on copper substrate 期刊论文 Journal of Materials Science: Materials in Electronics, 2021, 卷号: 32, 期号: 1, 页码: 1073-1079 作者:  Sun, Xuemin;  Yu, Weiyuan;  Wang, Fengfeng;  Wang, Yanhong 收藏  |  浏览/下载：13/0  |  提交时间：2021/03/02 Copper  Tin  Ultrasonic effects  Ultrasonic testing  Ultrasonic waves  Wetting  Acoustic cavitations  Additional forces  Copper substrates  Cross-section morphology  Interfacial atoms  Ultrasonic sound  Ultrasonic vibration  Wetting balance methods   Effect of Ultrasound on Dissolution Acceleration Behavior of Ni/Sn 期刊论文 Xiyou Jinshu Cailiao Yu Gongcheng/Rare Metal Materials and Engineering, 2020, 卷号: 49, 期号: 7, 页码: 2365-2371 作者:  Liu, Yun;  Yu, Weiyuan;  Sun, Jungang;  Sun, Xuemin;  Wang, Fengfeng 收藏  |  浏览/下载：2/0  |  提交时间：2020/11/14 Binary alloys  Dissolution  Nickel  Tin  Ultrasonic effects  Acceleration behavior  Dissolution behavior  Holding time  Molten solders  Rod-shaped  Subsequent cooling  Ultrasonic cavitation  Ultrasonic vibration   Effect of Ultrasound on Dissolution Acceleration Behavior of Ni/Sn 期刊论文 Xiyou Jinshu Cailiao Yu Gongcheng/Rare Metal Materials and Engineering, 2020, 卷号: 49, 期号: 7, 页码: 2365-2371 作者:  Liu, Yun;  Yu, Weiyuan;  Sun, Jungang;  Sun, Xuemin;  Wang, Fengfeng 收藏  |  浏览/下载：5/0  |  提交时间：2022/02/17 Binary alloys  Dissolution  Nickel  Tin  Ultrasonic effects  Acceleration behavior  Dissolution behavior  Holding time  Molten solders  Rod-shaped  Subsequent cooling  Ultrasonic cavitation  Ultrasonic vibration   Effect of ultrasonic vibration on interfacial reaction of Ni/Sn/Ni soldered joint 期刊论文 Soldering and Surface Mount Technology, 2020, 卷号: 32, 期号: 2, 页码: 73-81 作者:  Liu, Yun;  Yu, Weiyuan;  Sun, Xuemin;  Wang, Fengfeng 收藏  |  浏览/下载：9/0  |  提交时间：2022/02/17 Binary alloys  Dissolution  Electronics packaging  Energy dispersive spectroscopy  Intermetallics  Lead-free solders  Morphology  Needles  Scanning electron microscopy  Shear flow  Soldered joints  Soldering  Tin  Tin alloys  Tin metallography  Ultrasonic effects  Ultrasonic waves  Uranium metallography  Vanadium metallography  Design/methodology/approach  Dispersion strengthening  Energy dispersive X ray spectroscopy  Fractured surfaces  Grain morphologies  Grooves  Ultrasonic cavitation  Ultrasonic vibration   Effect of ultrasonic vibration on interfacial reaction of Ni/Sn/Ni soldered joint 期刊论文 SOLDERING & SURFACE MOUNT TECHNOLOGY, 2019, 卷号: 32, 期号: 2, 页码: 73-81 作者:  Liu, Yun;  Yu, Weiyuan;  Sun, Xuemin;  Wang, Fengfeng 收藏  |  浏览/下载：0/0  |  提交时间：2020/06/16 Intermetallic compounds  Grooves  Ultrasonic vibration  Dissolution  IMC