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Measurement-based electrical characterization of through silicon vias and transmission lines for 3D integration 期刊论文
MICROELECTRONIC ENGINEERING, 2016
Sun, Xin; Fang, Runiu; Zhu, Yunhui; Zhong, Xiao; Bian, Yuan; Guan, Yong; Miao, Min; Chen, Jing; Jin, Yufeng
收藏  |  浏览/下载：2/0  |  提交时间：2017/12/03
Numerical modeling and experimental verification of through silicon via (TSV) filling in presence of additives 期刊论文
微电子工程, 2014
Zhu, Yunhui; Ma, Shenglin; Sun, Xin; Chen, Jing; Miao, Min; Jin, Yufeng
收藏  |  浏览/下载：2/0  |  提交时间：2015/11/10
Electrical measurement and analysis of TSV/RDL for 3D integration 其他
2014-01-01
Sun, Xin; Fang, Runiu; Zhu, Yunhui; Zhong, Xiao; Bian, Yuan; Ma, Shenglin; Miao, Min; Chen, Jing; Wang, Yan; Jin, Yufeng
收藏  |  浏览/下载：4/0  |  提交时间：2015/11/17
A Wafer Level Through-Stack-Via Integration Process with One-time Bottom-up Copper Filling 其他
2014-01-01
Zhu, Yunhui; Ma, Shenglin; Sun, Xin; Fang, Runiu; Zhong, Xiao; Bian, Yuan; Guan, Yong; Chen, Jing; Miao, Min; Jin, Yufeng
收藏  |  浏览/下载：2/0  |  提交时间：2017/12/03
Low-frequency Testing of Through Silicon Vias for Defect Diagnosis in Three-dimensional Integration Circuit Stacking Technology 其他
2014-01-01
Xu, Yichao; Miao, Min; Fang, Runiu; Sun, Xin; Zhu, Yunhui; Sun, Minggang; Wang, Guanjiang; Jin, Yufeng
收藏  |  浏览/下载：5/0  |  提交时间：2017/12/03
Investigation of a TSV-RDL In-line Fault-Diagnosis System and Test Methodology for Wafer-level Commercial Production 其他
2014-01-01
Fang, Runiu; Miao, Min; Sun, Xin; Zhu, Yunhui; Wang, Guanjiang; Xu, Yichao; Sun, Minggang; Jin, Yufeng
收藏  |  浏览/下载：3/0  |  提交时间：2017/12/03
Electrical Simulation and Analysis of Si Interposer for 3D IC Integration 其他
2014-01-01
Sun, Xin; Miao, Min; Zhu, Yunhui; Fang, Runiu; Wang, Guanjiang; Lu, Wengao; Chen, Jing; Jin, Yufeng
收藏  |  浏览/下载：2/0  |  提交时间：2017/12/03
Development and Characterization of a Through-Multilayer TSV Integrated SRAM Module 其他
2013-01-01
Zhu, Yunhui; Ma, Shenglin; Sun, Xin; Fang, Runiu; Zhong, Xiao; Bian, Yuan; Chen, Meng; Chen, Jing; Miao, Min; Lu, Wengao; Jin, Yufeng
收藏  |  浏览/下载：8/0  |  提交时间：2015/11/16
Investigations of Silicon Wafer Bonding Using Thin Al and Sn Films for Heterogeneous Integration 其他
2013-01-01
Zhu, Zhiyuan; Wang, Shaonan; Xu, Yichao; Wang, Guanjiang; Pi, Yudan; Wang, Peiquan; Zhu, Yunhui; Sun, Xin; Yu, Min; Chen, Jing; Miao, Min; Jin, Yufeng
收藏  |  浏览/下载：5/0  |  提交时间：2015/11/13
A high-capacity lithium-air battery with Pd modified carbon nanotube sponge cathode working in regular air 期刊论文
炭素, 2013
Shen, Yue; Sun, Dan; Yu, Ling; Zhang, Wang; Shang, Yuanyuan; Tang, Huiru; Wu, Junfang; Cao, Anyuan; Huang, Yunhui
收藏  |  浏览/下载：3/0  |  提交时间：2015/11/11

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