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科研机构
北京大学 [99]
内容类型
其他 [59]
期刊论文 [38]
会议论文 [2]
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2017 [4]
2016 [29]
2015 [9]
2014 [11]
2013 [11]
2012 [14]
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专题:北京大学
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Influence of Viscoelastic Underfill on Thermal Mechanical Reliability of a 3-D-TSV Stack by Simulation
期刊论文
IEEE TRANSACTIONS ON DEVICE AND MATERIALS RELIABILITY, 2017
Zeng, Qinghua
;
Guan, Yong
;
Su, Fei
;
Chen, Jing
;
Jin, Yufeng
收藏
  |  
浏览/下载:6/0
  |  
提交时间:2017/12/03
Microbump
thermal mechanical reliability
through-silicon-via
underfill
viscoelasticity
SOLDER
WARPAGE
FATIGUE
PACKAGE
Biological effect and molecular mechanism study of biomaterials based on proteomic research
期刊论文
JOURNAL OF MATERIALS SCIENCE & TECHNOLOGY, 2017
Zhen, Zhen
;
Zheng, Yufeng
;
Ge, Zigang
;
Lai, Chen
;
Xi, Tingfei
收藏
  |  
浏览/下载:4/0
  |  
提交时间:2017/12/03
Proteomics
Biomaterials
Biological effect
Molecular mechanism
HUMAN DERMAL FIBROBLASTS
GOLD NANOPARTICLES
SILVER NANOPARTICLES
BIOCOMPATIBILITY
TITANIUM
DIFFERENTIATION
SCAFFOLD
CELLS
Fabrication and Comparison of Bumpless Wafer-on-Wafer Integration and Bump-Containing Chip-on-Chip Integration
期刊论文
IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 2017
Guan, Yong
;
Zhu, Yunhui
;
Ma, Shenglin
;
Zeng, Qinghua
;
Chen, Jing
;
Jin, Yufeng
收藏
  |  
浏览/下载:6/0
  |  
提交时间:2017/12/03
3-D packaging
chip-on-chip (CoC) integration
reliability
through silicon via (TSV)
wafer-on-wafer (WoW) integration
PIEZORESISTIVE STRESS SENSOR
THROUGH-SILICON
RELIABILITY
INTERCONNECTS
VOLUME
VIAS
Evolution of the degradation mechanism of pure zinc stent in the one-year study of rabbit abdominal aorta model
期刊论文
BIOMATERIALS, 2017
Yang, Hongtao
;
Wang, Cong
;
Liu, Chaoqiang
;
Chen, Houwen
;
Wu, Yifan
;
Han, Jintao
;
Jia, Zichang
;
Lin, Wenjiao
;
Zhang, Deyuan
;
Li, Wenting
;
Yuan, Wei
;
Guo, Hui
;
Li, Huafang
;
Yang, Guangxin
;
Kong, Deling
;
Zhu, Donghui
;
Takashima, Kazuki
;
Ruan, Liqun
;
Nie, Jianfeng
;
Li, Xuan
;
Zheng, Yufeng
收藏
  |  
浏览/下载:6/0
  |  
提交时间:2017/12/03
Pure zinc stent
Rabbit abdominal aorta
Degradation behavior
Degradation mechanism
Biocompatibility
PORCINE CORONARY-ARTERIES
MAGNESIUM ALLOY STENTS
OPTICAL COHERENCE TOMOGRAPHY
ABSORBABLE METAL SCAFFOLD
IN-VITRO
INTRAVASCULAR ULTRASOUND
BIOMEDICAL APPLICATIONS
CARDIOVASCULAR STENTS
BIOABSORBABLE STENTS
BIODEGRADABLE METALS
Novel loci and pathways significantly associated with longevity
期刊论文
SCIENTIFIC REPORTS, 2016
Zeng, Yi
;
Nie, Chao
;
Min, Junxia
;
Liu, Xiaomin
;
Li, Mengmeng
;
Chen, Huashuai
;
Xu, Hanshi
;
Wang, Mingbang
;
Ni, Ting
;
Li, Yang
;
Yan, Han
;
Zhang, Jin-Pei
;
Song, Chun
;
Chi, Li-Qing
;
Wang, Han-Ming
;
Dong, Jie
;
Zheng, Gu-Yan
;
Lin, Li
;
Qian, Feng
;
Qi, Yanwei
;
Liu, Xiao
;
Cao, Hongzhi
;
Wang, Yinghao
;
Zhang, Lijuan
;
Li, Zhaochun
;
Zhou, Yufeng
;
Wang, Yan
;
Lu, Jiehua
;
Li, Jianxin
;
Qi, Ming
;
Bolund, Lars
;
Yashin, Anatoliy
;
Land, Kenneth C.
;
Gregory, Simon
;
Yang, Ze
;
Gottschalk, William
;
Tao, Wei
;
Wang, Jian
;
Wang, Jun
;
Xu, Xun
;
Bae, Harold
;
Nygaard, Marianne
;
C
收藏
  |  
浏览/下载:5/0
  |  
提交时间:2017/12/03
GENOME-WIDE ASSOCIATION
ALZHEIMERS-DISEASE
LIFE-SPAN
GENETIC ASSOCIATION
FOXO GENOTYPES
ADVANCED AGES
HAN CHINESE
METAANALYSIS
SURVIVAL
POPULATION
A flexible device for ocular iontophoretic drug delivery
期刊论文
5th International Conference on Optofluidics (Optofluidics), 2016
Zhang, Yushi
;
Chen, Yao
;
Yu, Xiaoxue
;
Qi, Yangjia
;
Chen, Yufeng
;
Liu, Yuxi
;
Hu, Yuntao
;
Li, Zhihong
收藏
  |  
浏览/下载:2/0
  |  
提交时间:2017/12/03
EX-VIVO
TRANSCORNEAL
RELEASE
PROTEIN
EYE
Measurement-based electrical characterization of through silicon vias and transmission lines for 3D integration
期刊论文
MICROELECTRONIC ENGINEERING, 2016
Sun, Xin
;
Fang, Runiu
;
Zhu, Yunhui
;
Zhong, Xiao
;
Bian, Yuan
;
Guan, Yong
;
Miao, Min
;
Chen, Jing
;
Jin, Yufeng
收藏
  |  
浏览/下载:2/0
  |  
提交时间:2017/12/03
3D integration
Through silicon via (TSV)
Transmission line
Electrical measurement
RF characterization
THROUGH-SILICON
TSV
MODEL
INTERCONNECT
STACKING
Evaluation and Optimization of Thermo-Mechanical Reliability of a TSV-based 3D MEMS
其他
2016-01-01
Zeng, Qinghua
;
Guan, Yong
;
Chen, Jing
;
Meng, Wei
;
Jin, Yufeng
收藏
  |  
浏览/下载:5/0
  |  
提交时间:2017/12/03
TSV
MEMS
Thermo-mechanical Reliability
Seal Ring
Optimization
INTEGRATION
Simulation and evaluation of thermal mechanical reliability of 3D-TSV stack with viscoelastic underfill
其他
2016-01-01
Zeng, Qinghua
;
Guan, Yong
;
Su, Fei
;
Chen, Jing
;
Jin, Yufeng
收藏
  |  
浏览/下载:6/0
  |  
提交时间:2017/12/03
Fabrication, Characterization, and Simulation of a Low-Cost TSV Integration Without Front-Side CMP Process
期刊论文
IEEE TRANSACTIONS ON SEMICONDUCTOR MANUFACTURING, 2016
Guan, Yong
;
Zhu, Yunhui
;
Ma, Shenglin
;
Zeng, Qinghua
;
Chen, Jing
;
Jin, Yufeng
收藏
  |  
浏览/下载:2/0
  |  
提交时间:2017/12/03
3D packaging
through silicon via
memory stacking
bonding strength
THROUGH-SILICON VIAS
3-D
TECHNOLOGY
INTERCONNECTS
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