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华南理工大学 [17]
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会议 [17]
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Microstructure and mechanical property of Ti3AlC2/TiAl3 composite synthesized by hot pressing (EI收录)
会议
Chengdu, China,
作者:
Chen, Wei Ping[1]
;
Zeng, Yong[1]
;
Li, Xiao Mei[1]
;
Xiao, Hua Qiang[2]
收藏
  |  
浏览/下载:8/0
  |  
提交时间:2019/04/11
Aluminum
Ball milling
Bending strength
Cracks
Failure (mechanical)
Fracture toughness
Hot pressing
Mechanical properties
Milling (machining)
Powders
Scanning electron microscopy
Titanium alloys
Titanium compounds
Vickers hardness
X ray diffraction
X ray powder diffraction
Performance analysis of pre-oxidation process direct bonding copper substrate (CPCI-S收录)
会议
作者:
Ning, Honglong[1,2,5]
;
Hu, Shiben[1,2]
;
Tao, Ruiqiang[1,2]
;
Liu, Xianzhe[1,2]
;
Zeng, Yong[1,2]
收藏
  |  
浏览/下载:1/0
  |  
提交时间:2019/04/11
pre-oxidation process
direct bonding copper
dielectric dissipation
relative dielectric constant
electronic speckle pattern interferometer
Fabrication Process of a Triple-Layer Stacked TSV Interposer for Switch Matrix Consisting of Eight RF Chips (CPCI-S收录)
会议
作者:
Meng, Wei[1]
;
Guan, Yong[2]
;
Zeng, Qinghua[2]
;
Chen, Jing[2]
;
Jin, Yufeng[1,2]
收藏
  |  
浏览/下载:3/0
  |  
提交时间:2019/04/11
Highly stable and efficient platinum nanoparticles supported on TiO2@Ru-C: investigations on the promoting effects of the interpenetrated TiO (CPCI-S收录)
会议
作者:
Li, Zuopeng[1]
;
Guo, Yong[1]
;
Liu, Zhen[2]
;
Wu, Xin[2]
;
Zeng, Jianhuang[2]
收藏
  |  
浏览/下载:13/0
  |  
提交时间:2019/04/11
TiO2@Ru
stability
electrocatalysts
utilization efficiency
Fabrication and Traceable Quality Evaluation of Fine Pitch TSV with Self-integrated Micro Heater and Thermocouple (CPCI-S收录)
会议
作者:
Guan, Yong[1]
;
Zeng, Qinghua[1]
;
Bian, Yuan[1]
;
Zhong, Xiao[1]
;
Chen, Jing[1]
收藏
  |  
浏览/下载:8/0
  |  
提交时间:2019/04/11
3D packaging
fine pitch TSV
micro heater
thermocouple
quality evaluation
Triple Bands MIMO Antenna for WLAN Applications (CPCI-S收录)
会议
作者:
Jin, Guiping[1]
;
Huang, Yong[1]
;
Deng, Chuhong[1]
;
Zeng, Guangde[1]
收藏
  |  
浏览/下载:1/0
  |  
提交时间:2019/04/11
Fabrication and Characterization of Fine Pitch TSV Integration with Self-aligned Backside Insulation Layer Opening (CPCI-S收录)
会议
作者:
Guan, Yong[1]
;
Zeng, Qinghua[1]
;
Chen, Jing[1]
;
Ma, Shenglin[2]
;
Jin, Yufeng[3]
收藏
  |  
浏览/下载:8/0
  |  
提交时间:2019/04/11
TSV
3D packaging
sidewall insulation
electrical properties
CMP
Triple bands MIMO antenna for WLAN applications (EI收录)
会议
Singapore, Singapore,
作者:
Jin, Guiping[1]
;
Huang, Yong[1]
;
Deng, Chuhong[1]
;
Zeng, Guangde[1]
收藏
  |  
浏览/下载:2/0
  |  
提交时间:2019/04/11
Antennas
MIMO systems
Monopole antennas
Wireless local area networks (WLAN)
Thermal-Mechanical Reliability Assessment of TSV Structure for 3D IC Integration (CPCI-S收录)
会议
作者:
Liu, Huan[1]
;
Zeng, Qinghua[1]
;
Guan, Yong[1]
;
Fang, Runiu[1]
;
Sun, Xin[1]
收藏
  |  
浏览/下载:2/0
  |  
提交时间:2019/04/11
Fabrication Process of a TSV Interposer for Radio Frequency Chip with Integrated Passive Devices (CPCI-S收录)
会议
作者:
Meng, Wei[1]
;
Jin, Yufeng[1]
;
Guan, Yong[2]
;
Zeng, Qinghua[2]
;
Hen, Jing C.[2]
收藏
  |  
浏览/下载:4/0
  |  
提交时间:2019/04/11
TSV Interposer
Lift-off Process
Interated Passive Devices
Radio Frequency System
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