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浏览/检索结果: 共11条，第1-10条 帮助 限定条件 内容类型：会议     已选(0)清除 条数/页：5101520253035404550556065707580859095100   排序方式：请选择作者升序作者降序题名升序题名降序发表日期升序发表日期降序提交时间升序提交时间降序 Serum Apolipoprotein B is inversely associated with left ventricular remodeling in Peritoneal Dialysis Patients (CPCI-S收录) 会议 作者:  Yao, Fengjuan[1];  Ye, Min[1];  Liu, Yan Qiu[1];  Tian, Na[1];  Liu, Dong Hong[1] 收藏  |  浏览/下载：2/0  |  提交时间：2019/04/11 Phase field crystal simulation of morphological evolution and growth kinetics of Kirkendall voids at the interface and in the intermetallic c (CPCI-S收录) 会议 作者:  Ma, Wen-Jing[1];  Ke, Chang-Bo[1];  Liang, Shui-bao[1];  Zhou, Min-Bo[1];  Zhang, Xin-Ping[1] 收藏  |  浏览/下载：16/0  |  提交时间：2019/04/11 Kirkendall void  growth exponent  morphological evolution  cyclic loading  phase field cystal model   The Quantitative Indicators of 750kV Porcelain Insulator in UV Detection Based on Artificial Contamination Test (CPCI-S收录) 会议 作者:  Cai-Jing[1];  Zhang Nan[1];  Ma-Zhong[1];  Peng-Min[1];  Shang Xiaoguang[2] 收藏  |  浏览/下载：2/0  |  提交时间：2019/04/11 UV detection  UV photon number  spot area  Discharge severity   Phase Field Simulation of Segregation of the Bi-riched Phase in Cu/Sn-Bi/Cu Solder Interconnects under Electric Current Stressing (CPCI-S收录) 会议 作者:  Liang, Shui-Bao[1];  Ke, Chang-Bo[1];  Ma, Wen-Jing[1];  Zhou, Min-Bo[1];  Zhang, Xin-Ping[1] 收藏  |  浏览/下载：3/0  |  提交时间：2019/04/11 segregation  electromigration  Sn-Bi solder  interconnect  phase field simulation   Phase field crystal simulation of morphological evolution and propagation of microcracks in the intermetallic compound layer of Sn/Cu solder (CPCI-S收录) 会议 作者:  Ma, Wen-Jing[1];  Ke, Chang-Bo[1];  Zhou, Min-Bo[1];  Zhang, Xin-Ping[1] 收藏  |  浏览/下载：10/0  |  提交时间：2019/04/11 Phase field crystal model  Microstructure evolution  Microcrack propagation  Strain   Effects of flux activators and processing parameters on solderability and stability of the aluminum solder paste used for automated assembly (CPCI-S收录) 会议 作者:  Zhang, Lang;  Zhou, Min-Bo;  Qiu, Fu-Shun;  Ma, Xiao;  Zhang, Xin-Ping[1] 收藏  |  浏览/下载：2/0  |  提交时间：2019/04/11 aluminum solder paste  activator  processing parameter  solderability  stability  LED assembly   Effect of Aerobic Exercise on LV Diastolic Function in Chinese Mild Hypertensive Patients (CPCI-S收录) 会议 作者:  Yao, Fengjuan[1];  Ye, Min[1];  Li, Wei[1];  Liang, Jianwen[1];  Liu, Yanqiu[1] 收藏  |  浏览/下载：2/0  |  提交时间：2019/04/11 Hydrogen generation via hydrolysis of H-CaMg2 and H-CaMg1.9Ni0.1 (CPCI-S收录) 会议 作者:  Ma, Miaolian[1,2];  Duan, Ruoming[1,2];  Ouyang, Liuzhang[1,2,3,4];  Zhu, Xiaoke[1,2];  Peng, Chenghong[1,2] 收藏  |  浏览/下载：11/0  |  提交时间：2019/04/11 Hydrogen generation  CaMg1.9Ni0.1 alloy  Hydrolysis  Apparent activation energy   Dynamic wetting behavior and solder ball spattering formation of Sn-Bi solder pastes during reflow soldering process (CPCI-S收录) 会议 作者:  Tan, Meng-Ying;  Zhou, Min-Bo;  Huang, Lia-Qiang;  Ma, Fa-Qian;  Ma, Xiao 收藏  |  浏览/下载：4/0  |  提交时间：2019/04/11 surface defect  solder ball spattering  Sn-Bi solder paste  reflow soldering process   Influence of the solder volume and reflow process on solderability of the aluminum solder paste and reliability of Sn-0.3Ag-0.7Cu/6061Al sold (CPCI-S收录) 会议 作者:  Lin, Yuan-Jiang[1];  Zhou, Min-Bo[1];  Ma, Xiao[1];  Zhang, Xin-Ping[1] 收藏  |  浏览/下载：4/0  |  提交时间：2019/04/11 Aluminum solder paste  reflow process  soldering parameter  reliability