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浏览/检索结果: 共6条，第1-6条 帮助 限定条件 内容类型：会议     已选(0)清除 条数/页：5101520253035404550556065707580859095100   排序方式：请选择作者升序作者降序题名升序题名降序发表日期升序发表日期降序提交时间升序提交时间降序 Bioinformatic Analysis of Genes Functioning in Salt Tolerance from Genomes of Two Bacillus Cereus Strains (CPCI-S收录) 会议 作者:  Xie, Jin-Hong[1];  Xu, Zhen-Bo[1,2,3];  Li, Bing[1,3];  Li, Lin[1,3] 收藏  |  浏览/下载：6/0  |  提交时间：2019/04/11 Bacillus Cereus  Salt Tolerance  Genomes Sequence   Fabrication of a hybrid paste consisting of microscale Ag-plated Cu flakes and nanoscale Ag particles and characterization of low-temperature (CPCI-S收录) 会议 作者:  Jin, Hong;  Zhu, Jie-Fei;  Zhou, Min-Bo;  Zhang, Xin-Ping[1] 收藏  |  浏览/下载：6/0  |  提交时间：2019/04/11 Ag-plated Cu flakes  plating process  hybrid paste  sintered joints   Fabrication of ultra low-density binderless sandwiching materials by rapid steam injection (EI收录) 会议 Hunan, China, 作者:  Cheng, Fan[1];  Jiang, Yu-Hao[1];  Chen, Jin-Bo[1];  Lu, Peng-Bo[1];  Su, Ling-Feng[1] 收藏  |  浏览/下载：4/0  |  提交时间：2019/04/11 Acoustic wave absorption  Bending strength  Bins  Building materials  Functional materials  Insulation  Noise abatement  Sound insulating materials  Sound insulation  Steam  Wood   Electrical property of electrically conductive adhesives filled with micro-sized Ag flakes and modified by dicarboxylic acids (CPCI-S收录) 会议 作者:  Zhu, Jie-Fei;  Jin, Hong;  Zhou, Min-Bo;  Zhang, Xin-Ping[1] 收藏  |  浏览/下载：3/0  |  提交时间：2019/04/11 Electrically conductive adhesive  electrical conductivity  dicarboxylic acid  in-situ replacement  silver flake surfactant   Studies on Salt Tolerance of Bacillus Isolated from the Industrial Soy Sauce Residue (CPCI-S收录) 会议 作者:  Xu, Zhen-bo[1,2];  Bao, Xue-rui[1];  Ji, Li-li[1];  Duan, Jing-jing[1];  Jin, He-po[1] 收藏  |  浏览/下载：6/0  |  提交时间：2019/04/11 Quasi in-situ study of morphological evolution of the interfacial IMC in single-sided interface Sn-0.3Ag-0.7Cu/Cu joints during multiple refl (CPCI-S收录) 会议 作者:  Zhou, Min-Bo[1];  Jin, Hong[1];  Ke, Chang-Bo[1];  Zhang, Xin-Ping[1] 收藏  |  浏览/下载：10/0  |  提交时间：2019/04/11 morphological evolution  intermetallic compounds  lead-free solder joint  multiple reflow  quasi in-situ method