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浏览/检索结果: 共9条，第1-9条 帮助 限定条件 内容类型：会议论文     已选(0)清除 条数/页：5101520253035404550556065707580859095100   排序方式：请选择作者升序作者降序题名升序题名降序发表日期升序发表日期降序提交时间升序提交时间降序 Research on an Agent-Based Intelligent Social Tagging Recommendation System 会议论文 9th International Conference on Intelligent Human-Machine Systems and Cybernetics, IHMSC 2017, August 26, 2017 - August 27, 2017 作者:  An, Shihu;  Zhao, Zhikun;  Zhou, Hong 收藏  |  浏览/下载：3/0  |  提交时间：2019/12/31 Finding full coverage agent group (FCAG) of information diffusion in online social networks 会议论文 7th International Conference on Computer Engineering and Networks, CENet 2017, July 22, 2017 - July 23, 2017 作者:  An, Shihu;  Zhao, Zhikun 收藏  |  浏览/下载：2/0  |  提交时间：2019/12/31 Research on an Agent-based Intelligent Social Tagging Recommendation System 会议论文 9th International Conference on Intelligent Human-Machine Systems and Cybernetics (IHMSC), AUG 26-27, 2017 作者:  An, Shihu;  Zhao, Zhikun;  Zhou, Hong 收藏  |  浏览/下载：6/0  |  提交时间：2019/12/31 social tagging recommendation  personalized recommendation  common  preference group recommendation  self-adaptive recommendation  Agent  technology   A ground-based teaching and experimental simulation system for earth observing digital aerial remote sensing 会议论文 2007 1st International Symposium on Information Technologies and Applications in Education, ISITAE 2007,, Kunming, China, November 23, 2007 - November 25,2007 Yan, Lei; Ding, Jie; Qin, Qiming; Liu, Yuefeng; Zhao, Hongying; Liu, Daping; Zhao, Shihu; Gao, Pengqi; Lian, Zhouhui 收藏  |  浏览/下载：14/0  |  提交时间：2014/12/07 Teaching  Autonomous underwater vehicles  Experiments  Image reconstruction  Information technology  Remote sensing   Packaging issues on combination of LED and flip chip 会议论文 2005 Conference on High Density Microsystem Design and Packaging and Component Failure Analysis, HDP'05, 2005-06-27 作者:  Kun, Zhao[1];  Shiwei, Ma.[2];  Shihu, Su[3];  Jianhua, Zhang[4] 收藏  |  浏览/下载：11/0  |  提交时间：2019/05/10 Packaging issues on combination of LED and flip chip 会议论文 Proceedings of the Seventh IEEE CPMT Conference on High Density Microsystem Design, Packaging and Failure Analysis (HDP'05) 作者:  Zhao, Kun[1];  Ma, Shiwei[2];  Su, Shihu[3];  Zhang, Jianhua[4] 收藏  |  浏览/下载：5/0  |  提交时间：2019/05/10 Packaging issues on combination of LED and flip chip 会议论文 Proceedings of the Seventh IEEE CPMT Conference on High Density Microsystem Design, Packaging and Failure Analysis (HDP'05) 作者:  Zhao, Kun[1];  Ma, Shiwei[2];  Su, Shihu[3];  Zhang, Jianhua[4] 收藏  |  浏览/下载：3/0  |  提交时间：2019/05/10 Packaging issues on combination of LED and flip chip 会议论文 Proceedings of the Seventh IEEE CPMT Conference on High Density Microsystem Design, Packaging and Failure Analysis (HDP'05) 作者:  Zhao, Kun[1];  Ma, Shiwei[2];  Su, Shihu[3];  Zhang, Jianhua[4] 收藏  |  浏览/下载：3/0  |  提交时间：2019/05/10 Packaging issues on combination of LED and flip chip 会议论文 Proceedings of the Seventh IEEE CPMT Conference on High Density Microsystem Design, Packaging and Failure Analysis (HDP'05) 作者:  Zhao, Kun[1];  Ma, Shiwei[2];  Su, Shihu[3];  Zhang, Jianhua[4] 收藏  |  浏览/下载：3/0  |  提交时间：2019/05/10