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浏览/检索结果: 共10条，第1-10条 帮助 限定条件 内容类型：会议论文     已选(0)清除 条数/页：5101520253035404550556065707580859095100   排序方式：请选择作者升序作者降序题名升序题名降序发表日期升序发表日期降序提交时间升序提交时间降序 MOBILE TERMINATION LEARNING MODELS BASED ON CELL PHONE 会议论文 济南, 2009年1月1日 作者:  HAN XIAO-LING [1];  LI WEN-TING [2] 收藏  |  浏览/下载：2/0  |  提交时间：2020/01/04 Preparation and microstructure of bauxite ceramic microsphere (EI收录) 会议论文 Key Engineering Materials 作者:  Cheng, Xiao-Su[1];  Zeng, Ling-Ke[1];  Li, Xiu-Yan[1];  Sheng, Wen-Yan[1];  Shui, An-Ze[1] 收藏  |  浏览/下载：4/0  |  提交时间：2019/04/17 Metal oxide ceramics  Microstructure  Scanning electron microscopy  Spray drying  X ray diffraction   Impact of temperature cycling on copper interconnect (EI收录) 会议论文 Proceedings - 2010 11th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2010, Xi'an, China, August 16, 2010 - August 19, 2010 作者:  Lin, Xiao-Ling[1,2];  Hou, Tong-Xian[1];  Zhang, Xiao-Wen[2];  Yao, Ruo-He[1] 收藏  |  浏览/下载：5/0  |  提交时间：2019/04/16 Electronics packaging  Finite element method  Microelectronics  Morphology  Stress concentration   Thermal Stress Characteristics of Cu Interconnects Using Air-Gap (CPCI-S收录) 会议论文 2010 11TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY & HIGH DENSITY PACKAGING (ICEPT-HDP) 作者:  Lin Xiao-ling[1,2];  Hou Tong-xian[1];  Zhang Xiao-wen[2];  Yao Ruo-he[1] 收藏  |  浏览/下载：1/0  |  提交时间：2019/04/16 Thermal stress characteristics of cu interconnects using Air-Gap (EI收录) 会议论文 Proceedings - 2010 11th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2010, Xi'an, China, August 16, 2010 - August 19, 2010 作者:  Lin, Xiao-Ling[1,2];  Hou, Tong-Xian[1];  Zhang, Xiao-Wen[2];  Yao, Ruo-He[1] 收藏  |  浏览/下载：1/0  |  提交时间：2019/04/16 Dielectric materials  Electronics packaging  Packaging  Thermal stress  Thermoelasticity   Impact of Temperature Cycling on Copper Interconnect (CPCI-S收录) 会议论文 2010 11TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY & HIGH DENSITY PACKAGING (ICEPT-HDP) 作者:  Lin Xiao-ling[1,2];  Hou Tong-xian[1];  Zhang Xiao-wen[2];  Yao Ruo-he[1] 收藏  |  浏览/下载：1/0  |  提交时间：2019/04/16 Application of PEM and OBIRCH to defect localization of integrated circuits (EI收录) 会议论文 Advanced Materials Research, Yichang, China, January 10, 2014 - January 12, 2014 作者:  Lian, Jian Wen[1];  Lin, Xiao Ling[2];  Yao, Ruo He[1] 收藏  |  浏览/下载：2/0  |  提交时间：2019/04/12 Characterization  Design  Electric resistance  Manufacture  Microelectronics  Photons   Failure analysis and precaution of Plastic Encapsulated Microcircuits (EI收录) 会议论文 Proceedings of 2009 8th International Conference on Reliability, Maintainability and Safety, ICRMS 2009, Chengdu, China, July 20, 2009 - July 24, 2009 作者:  Lin, Xiao-Ling[1];  Yao, Ruo-He[1];  Kong, Xue-Dong[2];  Zhang, Xiao-Wen[2] 收藏  |  浏览/下载：1/0  |  提交时间：2019/04/17 Delamination  Failure analysis  Flip chip devices  Maintainability  Mold release agents  Plastic molds  Plastics  Reliability analysis  Steel sheet  Thermal expansion  Thermal stress   Failure Analysis and Precaution of Plastic Encapsulated Microcircuits (CPCI-S收录) 会议论文 PROCEEDINGS OF 2009 8TH INTERNATIONAL CONFERENCE ON RELIABILITY, MAINTAINABILITY AND SAFETY, VOLS I AND II: HIGHLY RELIABLE, EASY TO MAINTAIN AND READY TO SUPPORT 作者:  Lin, Xiao-ling[1];  Yao, Ruo-he[1];  Kong, Xue-dong[2];  Zhang, Xiao-wen[2] 收藏  |  浏览/下载：3/0  |  提交时间：2019/04/17 plastic encapsulated microcircuits (PEMs)  reliability  delamination  failure analysis  coefficient thermal expansion (CTE)   Mobile Termination Learning Models Based on Cell Phone 会议论文 Jinan, PEOPLES R CHINA, AUG 14-16, 2009 作者:  Han Xiao-ling[1];  Li Wen-ting[2] 收藏  |  浏览/下载：2/0  |  提交时间：2020/01/04