CORC

在结果中检索

CORC

浏览/检索结果: 共31条，第1-10条 帮助

限定条件    
已选(0)清除 条数/页：   排序方式：
Structural Dependency Self-attention Based Hierarchical Event Model for Chinese Financial Event Extraction 会议论文
Guangzhou, China, November 4-7, 2021
作者:  Liu Z(刘智);  Xu, Hao;  Wang, Haitao;  Zhou, Dan;  Qi, Guilin
收藏  |  浏览/下载：6/0  |  提交时间：2021/12/05
Challenges towards protecting VNF with SGX 会议论文
作者:  Wang, Juan;  Fan, Chengyang;  Hao, Shirong;  Wang, Jie;  Li, Yi
收藏  |  浏览/下载：4/0  |  提交时间：2019/12/05
Improved Reliability of Electrically Conductive Adhesives Joints on Cu-Plated PCB Substrate Enhanced by Graphene Protection Barrier 会议论文
2017 IMAPS NORDIC CONFERENCE ON MICROELECTRONICS PACKAGING (NORDPAC), 2017-01-01
作者:  Huang, Shirong[1];  Ke, Wei[2];  Yang, Yiqun[3];  Ye, Hui[4];  Chen, Shujing[5]
收藏  |  浏览/下载：41/0  |  提交时间：2019/04/24
Effect of sintering method on properties of nanosilver paste 会议论文
2017 IMAPS NORDIC CONFERENCE ON MICROELECTRONICS PACKAGING (NORDPAC), 2017-01-01
作者:  Zhang, Qiaoran[1];  Liu, Jiawen[2];  Ke, Wei[3];  Huang, Shirong[4];  Latorre, Marti Gutierrez[5]
收藏  |  浏览/下载：16/0  |  提交时间：2019/04/24
Graphene-based Heat Spreading Materials for Electronics Packaging Applications 会议论文
2017 IMAPS NORDIC CONFERENCE ON MICROELECTRONICS PACKAGING (NORDPAC), 2017-01-01
作者:  Yuan, Guangjie[1];  Shan, Bo[2];  Chen, Shujing[3];  Yang, Yiqun[4];  Bao, Jie[5]
收藏  |  浏览/下载：6/0  |  提交时间：2019/04/24
Heat Dissipation Performance of Graphene Enhanced Electrically Conductive Adhesive for Electronic Packaging 会议论文
2017 IMAPS NORDIC CONFERENCE ON MICROELECTRONICS PACKAGING (NORDPAC), 2017-01-01
作者:  Yang, Yiqun[1];  Ye, Hui[2];  Ke, Wei[3];  Huang, Shirong[4];  Wang, Nan[5]
收藏  |  浏览/下载：2/0  |  提交时间：2019/04/24
Post-Growth Processing of Carbon Nanotubes for Interconnect Applications - A Review 会议论文
6th Electronic System-Integration Technology Conference (ESTC)
作者:  Fu, Yifeng[1]
收藏  |  浏览/下载：22/0  |  提交时间：2019/04/26
2D HEAT DISSIPATION MATERIALS FOR MICROELECTRONICS COOLING APPLICATIONS 会议论文
China Semiconductor Technology International Conference (CSTIC), 2016-01-01
作者:  Zhang, Yong[1];  Huang, Shirong[2];  Wang, Nan[3];  Bao, Jie[4];  Sun, Shuangxi[5]
收藏  |  浏览/下载：11/0  |  提交时间：2019/04/26
Infrared Emissivity Measurement for Vertically Aligned Multiwall Carbon Nanotubes (CNTs) Based Heat Spreader Applied in High Power Electronics Packaging 会议论文
6th Electronic System-Integration Technology Conference (ESTC), 2016-09-13
作者:  Huang, Shirong[1];  Wang, Ning[2];  Bao, Jie[3];  Ye, Hui[4];  Zhang, Dongsheng[5]
收藏  |  浏览/下载：3/0  |  提交时间：2019/04/26
Development and Characterization of Graphene Enhanced Thermal Conductive Adhesives 会议论文
6th Electronic System-Integration Technology Conference (ESTC), 2016-09-13
作者:  Wang, Nan[1];  Logothetis, Nikolaos[2];  Wei, Mu[3];  Huang, Shirong[4];  Ye, Lilei[5]
收藏  |  浏览/下载：5/0  |  提交时间：2019/04/26

©版权所有 ©2017 CSpace - Powered by CSpace