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浏览/检索结果: 共16条，第1-10条 帮助 限定条件 内容类型：会议论文     已选(0)清除 条数/页：5101520253035404550556065707580859095100   排序方式：请选择作者升序作者降序题名升序题名降序发表日期升序发表日期降序提交时间升序提交时间降序 Hermetically metal sealing random vibration damage mechanism and fatigue life prediction (EI收录) 会议论文 Applied Mechanics and Materials, Dalian, China, August 24, 2013 - August 25, 2013 作者:  Han, Teng[1,2];  He, Xiao Qi[2];  En, Yun Fei[2] 收藏  |  浏览/下载：2/0  |  提交时间：2019/04/15 Failure (mechanical)  Fatigue of materials  Fourier transforms  Fracture mechanics  Manufacture  Metals  Polychlorinated biphenyls  Vibration analysis   Thermodynamics coupling analysis of grid-controlled electron gun (EI收录) 会议论文 Applied Mechanics and Materials, Dalian, China, August 24, 2013 - August 25, 2013 作者:  Song, Fang Fang[1];  Xu, Sha[2];  En, Yun Fei[1] 收藏  |  浏览/下载：3/0  |  提交时间：2019/04/15 Cathodes  Electron guns  Manufacture  Microwave tubes  Stress analysis  Temperature  Thermal stress  Thermoanalysis  Thermodynamics  Thermomechanical treatment   Bias dependence of dose rate effects in the irradiated substrate PNP transistors (EI收录) 会议论文 Proceedings of the International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA, Suzhou, China, July 15, 2013 - July 19, 2013 作者:  Liu, Yuan[1];  Shi, Qian[1];  Zhang, Ting[1,2];  En, Yun-Fei[1];  Li, Bin[1,2] 收藏  |  浏览/下载：0/0  |  提交时间：2019/04/15 Degradation  Failure analysis  Integrated circuits  Ionizing radiation   Experiment and Numerical Simulation of Total Dose Effects in The Substrate PNP Transistors (CPCI-S收录) 会议论文 PROCEEDINGS OF 2013 INTERNATIONAL CONFERENCE ON QUALITY, RELIABILITY, RISK, MAINTENANCE, AND SAFETY ENGINEERING (QR2MSE), VOLS I-IV 作者:  Zhang, Ting[1,2];  Liu, Yuan[2];  En, Yun-Fei[2];  He, Yu-Juan[2];  Liu, Jian-Bo[2] 收藏  |  浏览/下载：0/0  |  提交时间：2019/04/15 SPNP transistor  total dose  numerical simulation  oxide charge  interface trap   Loading rate and size effect on the fracture behavior of BGA structure Cu/Sn-3.0Ag-0.5Cu/Cu interconnects (EI收录) 会议论文 ICEPT-HDP 2012 Proceedings - 2012 13th International Conference on Electronic Packaging Technology and High Density Packaging, Guilin, China, August 13, 2012 - August 16, 2012 作者:  Li, Xun-Ping[1,2];  Qin, Hong-Bo[1];  En, Yun-Fei[2];  Xia, Jian-Min[1];  Zhang, Xin-Ping[1] 收藏  |  浏览/下载：0/0  |  提交时间：2019/04/15 Brittle fracture  Drops  Electronics packaging  Isotherms  Lead compounds  Microstructural evolution  Silver  Soldering alloys  Thermal aging   Experiment and numerical simulation of total dose effects in the substrate PNP transistors (EI收录) 会议论文 QR2MSE 2013 - Proceedings of 2013 International Conference on Quality, Reliability, Risk, Maintenance, and Safety Engineering, Sichuan, China, July 15, 2013 - July 18, 2013 作者:  Zhang, Ting[1,2];  Liu, Yuan[2];  En, Yun-Fei[2];  He, Yu-Juan[2];  Liu, Jian-Bo[2] 收藏  |  浏览/下载：1/0  |  提交时间：2019/04/15 Experiments  Maintenance  Numerical models  Safety engineering  Transistors   Effect of bias dependence of substrate NPN transistor on total dose irradiation (EI收录) 会议论文 2013 IEEE International Conference of Electron Devices and Solid-State Circuits, EDSSC 2013, Hong Kong, Hong kong, June 3, 2013 - June 5, 2013 作者:  Zhang, Ting[1,2];  Liu, Yuan[2];  Li, Bin[1];  En, Yun-Fei[2];  He, Yu-Juan[2] 收藏  |  浏览/下载：2/0  |  提交时间：2019/04/15 Degradation  Electric fields   Effect of Bias Dependence of Substrate NPN Transistor on Total Dose Irradiation (CPCI-S收录) 会议论文 2013 IEEE INTERNATIONAL CONFERENCE OF ELECTRON DEVICES AND SOLID-STATE CIRCUITS (EDSSC) 作者:  Zhang, Ting[1,2];  Liu, Yuan[2];  Li, Bin[1];  En, Yun-Fei[2];  He, Yu-Juan[2] 收藏  |  浏览/下载：0/0  |  提交时间：2019/04/15 NPN transistor  total dose  bias  fringing field  bulk field   Loading Rate and Size Effect on the Fracture Behavior of BGA Structure Cu/Sn-3.0Ag-0.5Cu/Cu Interconnects (CPCI-S收录) 会议论文 2012 13TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY & HIGH DENSITY PACKAGING (ICEPT-HDP 2012) 作者:  Li, Xun-Ping[1];  Qin, Hong-Bo[1];  En, Yun-Fei;  Xia, Jian-Min[1];  Zhang, Xin-Ping[1] 收藏  |  浏览/下载：0/0  |  提交时间：2019/04/15 Study on interfacial behavior and shear strength of lead-free micro-interconnect bump after SnPb reballing (EI收录) 会议论文 ICEPT-HDP 2012 Proceedings - 2012 13th International Conference on Electronic Packaging Technology and High Density Packaging, Guilin, China, August 13, 2012 - August 16, 2012 作者:  Zhou, Bin[1];  Zhou, Qing[1,2];  En, Yun-Fei[1] 收藏  |  浏览/下载：1/0  |  提交时间：2019/04/15 Coatings  Electronics packaging  Grain growth  Metallurgy  Nickel coatings  Soldering alloys