Loading Rate and Size Effect on the Fracture Behavior of BGA Structure Cu/Sn-3.0Ag-0.5Cu/Cu Interconnects (CPCI-S收录) | |
Li, Xun-Ping[1]; Qin, Hong-Bo[1]; En, Yun-Fei; Xia, Jian-Min[1]; Zhang, Xin-Ping[1] | |
会议名称 | 2012 13TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY & HIGH DENSITY PACKAGING (ICEPT-HDP 2012) |
URL标识 | 查看原文 |
内容类型 | 会议论文 |
URI标识 | http://www.corc.org.cn/handle/1471x/2054311 |
专题 | 华南理工大学 |
作者单位 | S China Univ Technol, Sch Mat Sci & Engn, Guangzhou 5LO640, Guangdong, Peoples R China |
推荐引用方式 GB/T 7714 | Li, Xun-Ping[1],Qin, Hong-Bo[1],En, Yun-Fei,等. Loading Rate and Size Effect on the Fracture Behavior of BGA Structure Cu/Sn-3.0Ag-0.5Cu/Cu Interconnects (CPCI-S收录)[C]. 见:2012 13TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY & HIGH DENSITY PACKAGING (ICEPT-HDP 2012). |
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