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CORC

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The influence of sintering process on thermal properties of nano-silver paste 会议论文
2018 19TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2018-01-01
作者:  Lu, Xiuzhen[1];  Zhang, Qianran[2];  Zehri, Abdelhafid[3];  Ke, Wei[4];  Huang, Shirong[5]
收藏  |  浏览/下载：15/0  |  提交时间：2019/04/22
An Overview of Carbon Nanotubes Based Interconnects for Microelectronic Packaging 会议论文
2017 IMAPS NORDIC CONFERENCE ON MICROELECTRONICS PACKAGING (NORDPAC), 2017-01-01
作者:  Chen, Shujing[1];  Shan, Bo[2];  Yang, Yiqun[3];  Yuan, Guangjie[4];  Huang, Shirong[5]
收藏  |  浏览/下载：17/0  |  提交时间：2019/04/24
Improved Reliability of Electrically Conductive Adhesives Joints on Cu-Plated PCB Substrate Enhanced by Graphene Protection Barrier 会议论文
2017 IMAPS NORDIC CONFERENCE ON MICROELECTRONICS PACKAGING (NORDPAC), 2017-01-01
作者:  Huang, Shirong[1];  Ke, Wei[2];  Yang, Yiqun[3];  Ye, Hui[4];  Chen, Shujing[5]
收藏  |  浏览/下载：41/0  |  提交时间：2019/04/24
Effect of sintering method on properties of nanosilver paste 会议论文
2017 IMAPS NORDIC CONFERENCE ON MICROELECTRONICS PACKAGING (NORDPAC), 2017-01-01
作者:  Zhang, Qiaoran[1];  Liu, Jiawen[2];  Ke, Wei[3];  Huang, Shirong[4];  Latorre, Marti Gutierrez[5]
收藏  |  浏览/下载：16/0  |  提交时间：2019/04/24
Heat Dissipation Performance of Graphene Enhanced Electrically Conductive Adhesive for Electronic Packaging 会议论文
2017 IMAPS NORDIC CONFERENCE ON MICROELECTRONICS PACKAGING (NORDPAC), 2017-01-01
作者:  Yang, Yiqun[1];  Ye, Hui[2];  Ke, Wei[3];  Huang, Shirong[4];  Wang, Nan[5]
收藏  |  浏览/下载：2/0  |  提交时间：2019/04/24
PREVENTING AGING OF ELECTRICALLY CONDUCTIVE ADHESIVES ON METAL SUBSTRATE USING GRAPHENE BASED BARRIER 会议论文
China Semiconductor Technology International Conference (CSTIC), 2016-01-01
作者:  Ye, Hui[1];  Huang, Shirong[2];  Yuan, Zhichao[3];  Lu, Xiuzhen[4];  Jeppson, Kjell[5]
收藏  |  浏览/下载：5/0  |  提交时间：2019/04/26
2D HEAT DISSIPATION MATERIALS FOR MICROELECTRONICS COOLING APPLICATIONS 会议论文
China Semiconductor Technology International Conference (CSTIC), 2016-01-01
作者:  Zhang, Yong[1];  Huang, Shirong[2];  Wang, Nan[3];  Bao, Jie[4];  Sun, Shuangxi[5]
收藏  |  浏览/下载：11/0  |  提交时间：2019/04/26
Thermal properties of TIM using CNTs forest in electronics packaging 会议论文
17th International Conference on Electronic Packaging Technology (ICEPT), 2016-08-16
作者:  Zhang, Dongsheng[1];  Liu, Jiawen[2];  Sun, Shuangxi[3];  Huang, Shirong[4];  Bao, Jie[5]
收藏  |  浏览/下载：12/0  |  提交时间：2019/04/26
Investigation of accelerated surface oxidation of Sn-3.5Ag-0.5Cu solder particles by TEM and STEM 会议论文
2011 International Symposium on Advanced Packaging Materials, APM 2011, 2011-10-25
作者:  Luo, Xin[1];  Du, Wenhui[2];  Lu, Xiuzhen[3];  Yamaguchi, Toshikazu[4];  Gavin, Jackson[5]
收藏  |  浏览/下载：3/0  |  提交时间：2019/04/30
Study on the Adhesion Strength of New Nano-structured Polymer-Metal Composite for Thermal Interface Material (Nano-TIM) under Different Pressures 会议论文
2011 12TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY AND HIGH DENSITY PACKAGING (ICEPT-HDP), 2011-08-08
作者:  Zhang, Lei[1];  Lu, Xiuzhen[2];  Luo, Xin[3];  Carlberg, Bjorn[4];  Zandira, Masoud[5]
收藏  |  浏览/下载：2/0  |  提交时间：2019/04/30

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