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浏览/检索结果: 共6条，第1-6条 帮助 限定条件 内容类型：会议论文    专题：华南理工大学    第一署名单位    第一作者单位    通讯作者单位     已选(0)清除 条数/页：5101520253035404550556065707580859095100   排序方式：请选择作者升序作者降序题名升序题名降序发表日期升序发表日期降序提交时间升序提交时间降序 Loading rate and size effect on the fracture behavior of BGA structure Cu/Sn-3.0Ag-0.5Cu/Cu interconnects (EI收录) 会议论文 ICEPT-HDP 2012 Proceedings - 2012 13th International Conference on Electronic Packaging Technology and High Density Packaging, Guilin, China, August 13, 2012 - August 16, 2012 作者:  Li, Xun-Ping[1,2];  Qin, Hong-Bo[1];  En, Yun-Fei[2];  Xia, Jian-Min[1];  Zhang, Xin-Ping[1] 收藏  |  浏览/下载：0/0  |  提交时间：2019/04/15 Brittle fracture  Drops  Electronics packaging  Isotherms  Lead compounds  Microstructural evolution  Silver  Soldering alloys  Thermal aging   Loading Rate and Size Effect on the Fracture Behavior of BGA Structure Cu/Sn-3.0Ag-0.5Cu/Cu Interconnects (CPCI-S收录) 会议论文 2012 13TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY & HIGH DENSITY PACKAGING (ICEPT-HDP 2012) 作者:  Li, Xun-Ping[1];  Qin, Hong-Bo[1];  En, Yun-Fei;  Xia, Jian-Min[1];  Zhang, Xin-Ping[1] 收藏  |  浏览/下载：0/0  |  提交时间：2019/04/15 Protein adsorption on titanium surface functionalized with bioactive gelatin methacrylate hydrogel coating (EI收录) 会议论文 Advanced Materials Research, Shanghai, China, June 28, 2014 - June 29, 2014 作者:  Tan, Guo Xin[1];  Tan, Ying[1];  Ning, Cheng Yun[2];  Zhang, Lin[3];  Zhou, Lei[1] 收藏  |  浏览/下载：1/0  |  提交时间：2019/04/12 Coatings  Engineering technology  Materials science  Titanium   The influence of imposed electric current on the tensile fracture behavior of micro-scale Cu/Sn-3.0Ag-0.5Cu/Cu solder joints (CPCI-S收录) 会议论文 2014 15TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT) 作者:  Li, Wang-Yun[1];  Qin, Hong-Bo[1];  Zhou, Min-Bo[1];  Zhang, Xin-Ping[1] 收藏  |  浏览/下载：1/0  |  提交时间：2019/04/12 Electrotensile  fracture behavior  microscale solder joint  Sn-3.0Ag-0.5Cu solder   Triple-band Monopole Antenna with Dual-sleeves Inside the Ground Plane (CPCI-S收录) 会议论文 APMC: 2009 ASIA PACIFIC MICROWAVE CONFERENCE, VOLS 1-5 作者:  Wang, Yun[1];  Zhang, Qiu-Yi[1];  Chu, Qing-Xin[1] 收藏  |  浏览/下载：0/0  |  提交时间：2019/04/17 triple-band  monopole antenna  WLAN/WiMAX  sleeve   Triple-band monopole antenna with dual-sleeves inside the ground plane (EI收录) 会议论文 APMC 2009 - Asia Pacific Microwave Conference 2009, Singapore, Singapore, December 7, 2009 - December 10, 2009 作者:  Wang, Yun[1];  Zhang, Qiu-Yi[1];  Chu, Qing-Xin[1] 收藏  |  浏览/下载：0/0  |  提交时间：2019/04/17 Antenna grounds  Frequency bands  Microwave antennas  Microwaves