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浏览/检索结果: 共14条，第1-10条 帮助 限定条件 内容类型：会议论文    专题：华南理工大学    第一署名单位    第一作者单位    通讯作者单位     已选(0)清除 条数/页：5101520253035404550556065707580859095100   排序方式：请选择作者升序作者降序题名升序题名降序发表日期升序发表日期降序提交时间升序提交时间降序 Preparation and microstructure of bauxite ceramic microsphere (EI收录) 会议论文 Key Engineering Materials 作者:  Cheng, Xiao-Su[1];  Zeng, Ling-Ke[1];  Li, Xiu-Yan[1];  Sheng, Wen-Yan[1];  Shui, An-Ze[1] 收藏  |  浏览/下载：4/0  |  提交时间：2019/04/17 Metal oxide ceramics  Microstructure  Scanning electron microscopy  Spray drying  X ray diffraction   The research on aggregate microstructure uniformity image processing of asphalt mixture based on computer scanning technology (EI收录) 会议论文 Advanced Materials Research, Hong Kong, China, December 7, 2013 - December 8, 2013 作者:  Zeng, Li Wen[1,2];  Zhang, Shun Xian[3];  Zhang, Xiao Ning[1] 收藏  |  浏览/下载：1/0  |  提交时间：2019/04/12 Agglomeration  Algorithms  Asphalt mixtures  Building materials  Civil engineering  Computerized tomography  Image segmentation  Microstructure  Quality control  Tomography   Crystallization kinetics analysis and SPS consolidation of mechanical alloyed Fe79Ti16P5 amorphous powders (EI收录) 会议论文 Applied Mechanics and Materials, Zhuhai, China, November 23, 2013 - November 24, 2013 作者:  Tang, Cui Yong[1];  Xiao, Zhi Yu[2];  Zhuang, Zhe Feng[1];  Dai, Wen Pan[1];  Meng, Su Ge[1] 收藏  |  浏览/下载：4/0  |  提交时间：2019/04/12 Activation energy  Amorphous alloys  Compressive strength  Crystallization kinetics  Mechanical alloying  Mechanical properties  Powders  Spark plasma sintering  Thermodynamic stability  Titanium   Marginal land-based biomass energy production in Yellow river delta (EI收录) 会议论文 Advanced Materials Research, Shanghai, China, November 12, 2013 - November 13, 2013 作者:  Wu, Cong Wen[1,2];  Chen, Xiao Bing[2,3];  Sun, Yun Peng[2,4];  Jiang, Ming Liang[2,5];  Yan, Kun[2,3] 收藏  |  浏览/下载：7/0  |  提交时间：2019/04/12 Crops  Energy utilization  Sustainable development   Preparation process and mechanism of CuO-MnO2-TiO2-V2O5 in the metallic luster glaze (EI收录) 会议论文 Applied Mechanics and Materials, Shenzhen, China, August 23, 2014 - August 24, 2014 作者:  Shi, Xiao Tao[1,2];  Feng, Jun Li[3];  Zhang, Ting[1];  Gao, Xue Wen[1] 收藏  |  浏览/下载：2/0  |  提交时间：2019/04/12 Instrument testing  Manganese  Manganese oxide  Manufacture  Metallic compounds  Metals  Titanium dioxide   RETRACTED ARTICLE: Enhancing phytoremediation of heavy metals contaminated soils (EI收录) 会议论文 5th International Conference on Bioinformatics and Biomedical Engineering, iCBBE 2011 作者:  Su, Xiao-Lang[1];  Wang, Dun-Qiu[1];  Cai, Xiang-Wen[2];  Zhang, Wen-Jie[1] 收藏  |  浏览/下载：2/0  |  提交时间：2019/04/15 Bioinformatics  Biomedical engineering  Bioremediation  Citric acid  Heavy metals  Soil pollution control  Soils   Impact of temperature cycling on copper interconnect (EI收录) 会议论文 Proceedings - 2010 11th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2010, Xi'an, China, August 16, 2010 - August 19, 2010 作者:  Lin, Xiao-Ling[1,2];  Hou, Tong-Xian[1];  Zhang, Xiao-Wen[2];  Yao, Ruo-He[1] 收藏  |  浏览/下载：5/0  |  提交时间：2019/04/16 Electronics packaging  Finite element method  Microelectronics  Morphology  Stress concentration   Thermal Stress Characteristics of Cu Interconnects Using Air-Gap (CPCI-S收录) 会议论文 2010 11TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY & HIGH DENSITY PACKAGING (ICEPT-HDP) 作者:  Lin Xiao-ling[1,2];  Hou Tong-xian[1];  Zhang Xiao-wen[2];  Yao Ruo-he[1] 收藏  |  浏览/下载：1/0  |  提交时间：2019/04/16 Recent Progress in Constraining the Equation of State of Dense Neutron-Rich Nuclear Matter with Heavy-Ion Reactions (CPCI-S收录) 会议论文 NUCLEAR PHYSICS A 作者:  Li, Bao-An[1];  Chen, Lie-Wen[2];  Wen, De-Hua[1,3];  Xiao, Zhigang[4];  Xu, Chang[1,5] 收藏  |  浏览/下载：2/0  |  提交时间：2019/04/16 Thermal stress characteristics of cu interconnects using Air-Gap (EI收录) 会议论文 Proceedings - 2010 11th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2010, Xi'an, China, August 16, 2010 - August 19, 2010 作者:  Lin, Xiao-Ling[1,2];  Hou, Tong-Xian[1];  Zhang, Xiao-Wen[2];  Yao, Ruo-He[1] 收藏  |  浏览/下载：1/0  |  提交时间：2019/04/16 Dielectric materials  Electronics packaging  Packaging  Thermal stress  Thermoelasticity