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浏览/检索结果: 共11条，第1-10条 帮助 限定条件 发表日期：2020     已选(0)清除 条数/页：5101520253035404550556065707580859095100   排序方式：请选择作者升序作者降序题名升序题名降序发表日期升序发表日期降序提交时间升序提交时间降序 Structure-based design, synthesis and bioactivity evaluation of macrocyclic inhibitors of mutant isocitrate dehydrogenase 2 (IDH2) displaying activity in acute myeloid leukemia cells 期刊论文 EUROPEAN JOURNAL OF MEDICINAL CHEMISTRY, 2020, 卷号: 203, 页码: 19 作者:  Che, Jinxin;  Huang, Feng;  Zhang, Mengmeng;  Xu, Gaoya;  Qu, Bingxue 收藏  |  浏览/下载：22/0  |  提交时间：2020/12/21 Metabolic pathways  Isocitrate dehydrogenase 2  Conformational restriction  Macrocyclic derivatives  Inhibitors   Structure-based design, synthesis and bioactivity evaluation of macrocyclic inhibitors of mutant isocitrate dehydrogenase 2 (IDH2) displaying activity in acute myeloid leukemia cells 期刊论文 EUROPEAN JOURNAL OF MEDICINAL CHEMISTRY, 2020, 卷号: 203, 页码: 19 作者:  Che, Jinxin;  Huang, Feng;  Zhang, Mengmeng;  Xu, Gaoya;  Qu, Bingxue 收藏  |  浏览/下载：23/0  |  提交时间：2020/12/21 Metabolic pathways  Isocitrate dehydrogenase 2  Conformational restriction  Macrocyclic derivatives  Inhibitors   Shear strength and fracture surface analysis of lead-free solder joints with high fraction of IMCs 期刊论文 Vacuum, 2020, 卷号: 180 作者:  Qiu, Hongyu;  Hu, Xiaowu;  Li, Shuang;  Wan, Yongqiang;  Li, Qinglin 收藏  |  浏览/下载：2/0  |  提交时间：2020/11/14 Binary alloys  Copper alloys  Elastic moduli  Fracture  Fracture mechanics  Shear flow  Soldered joints  Surface analysis  Tin alloys  Area ratios  Fracture mechanisms  Fracture surface analysis  Fracture surfaces  Fractured surfaces  Isothermal aging  Lead-free solder joint  Solder joints   Influences of different barrier films on microstructures and electrical properties of Bi2Te3-based joints 期刊论文 Journal of Materials Science: Materials in Electronics, 2020, 卷号: 31, 期号: 17, 页码: 14714-14729 作者:  Cheng, Jinxuan;  Hu, Xiaowu;  Li, Qinglin 收藏  |  浏览/下载：16/0  |  提交时间：2020/11/14 Bismuth compounds  Diffusion barriers  Gold  Gold compounds  Heat resistance  Microstructure  Nickel  Open circuit voltage  Soldering  Barrier films  Diffusion barrier films  Electrical resistances  Output current  Reflow--soldering  Solder joints  Temperature differences  Thermoelectric   Effects of the Ni electrodeposit on microstructure evolution and electrical resistance of the P-type Bi2Te3 solder joint 期刊论文 Journal of Alloys and Compounds, 2020, 卷号: 832 作者:  Cheng, Jinxuan;  Hu, Xiaowu;  Li, Qinglin 收藏  |  浏览/下载：21/0  |  提交时间：2020/11/14 Bismuth compounds  Diffusion  Electric resistance  Electrodes  Growth rate  IV-VI semiconductors  Microstructure  Scanning electron microscopy  Tin  Tin compounds  Transmission electron microscopy  Diffusion process  Electrical resistances  Micro-structure evolutions  Porous structures  Thermodynamically stable  Thermoelectric  Volume diffusion  X ray diffractometers   Effects of the Ni(P) plating thickness on microstructure evolution of interfacial IMCs in Sn–58Bi/Ni(P)/Cu solder joints 期刊论文 Journal of Materials Science: Materials in Electronics, 2020, 卷号: 31, 期号: 14, 页码: 11470-11481 作者:  Cheng, Jinxuan;  Hu, Xiaowu;  Zhang, Zhe;  Li, Qinglin 收藏  |  浏览/下载：5/0  |  提交时间：2020/11/14 Binary alloys  Diffusion  Growth rate  Soldering  Atomic diffusions  Compound layer  Diffusion channels  Diffusion process  Micro-structure evolutions  Plating thickness  Solder joint reliability  Solder joints   Effect of Co addition into Ni film on shear strength of solder/Ni/Cu system: Experimental and theoretical investigations 期刊论文 MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, 2020, 卷号: 788 作者:  Bi, Xiaoyang;  Hu, Xiaowu;  Li, Qinglin 收藏  |  浏览/下载：16/0  |  提交时间：2022/03/01 Solder joints  Ni-Co film  Shear strength  Atomic model  Intermetallic compound  First-principles calculations   Influences of Ni addition into Cu–xNi alloy on the microstructure evolution and mechanical property of Sn–58Bi/Cu–xNi solder joint 期刊论文 Applied Physics A: Materials Science and Processing, 2020, 卷号: 126, 期号: 4 作者:  Cheng, Jinxuan;  Hu, Xiaowu;  Li, Qinglin;  Jiang, Xiongxin 收藏  |  浏览/下载：4/0  |  提交时间：2020/11/14 Ductile fracture  Microstructure  Soldering  Fracture mechanisms  IMC layer  Liquid-state reaction  Micro-structure evolutions  Ni additions  Reflow--soldering  Solder joints  Synergistic effect   Fracture behavior and mechanical strength of sandwich structure solder joints with Cu–Ni(P) coating during thermal aging 期刊论文 Journal of Materials Science: Materials in Electronics, 2020, 卷号: 31, 期号: 5, 页码: 3876-3889 作者:  Xu, Tao;  Hu, Xiaowu;  Li, Jiayin;  Li, Qinglin 收藏  |  浏览/下载：2/0  |  提交时间：2020/11/14 Coatings  Fracture mechanics  Fracture testing  Sandwich structures  Thermal aging  Fractographic  Fracture behavior  Growth behavior  Mixed fractures  Pinning effects  Shear failure mode  Solder joints  Solid-state aging   Influence of additives on electroplated copper films and shear strength of SAC305/Cu solder joints 期刊论文 JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2020, 卷号: 31, 期号: 3, 页码: 2320-2330 作者:  Zhang, Xudong;  Hu, Xiaowu;  Jiang, Xiongxin;  Zhou, Liuru;  Li, Qinglin 收藏  |  浏览/下载：11/0  |  提交时间：2020/06/16 Additives  Atomic force microscopy  Binary alloys  Chlorine compounds  Copper  Copper compounds  Electron probe microanalysis  Electrons  High resolution transmission electron microscopy  Metallic films  Scanning electron microscopy  Tin alloys  Tin metallography  X ray photoelectron spectroscopy  Crystallographic orientations  Electron back scatter diffraction  Electroplated copper film  Electroplated Cu films  Impurity incorporation  Micro-structural characterization  Microstructural instability  Plating solutions