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浏览/检索结果: 共28条，第1-10条 帮助 限定条件 发表日期：2019     已选(0)清除 条数/页：5101520253035404550556065707580859095100   排序方式：请选择作者升序作者降序题名升序题名降序发表日期升序发表日期降序提交时间升序提交时间降序 Influence of benzotriazole on electroplated Cu films and interfacial microstructure evolution of solder joints 期刊论文 Journal of Materials Science: Materials in Electronics, 2019, 卷号: 30, 期号: 24, 页码: 21126-21137 作者:  Yi, Xiong;  Yi, Guangbin;  Hu, Xiaowu;  Li, Qinglin;  Zhang, Ruhua 收藏  |  浏览/下载：1/0  |  提交时间：2020/11/14 Atomic force microscopy  Coatings  Copper compounds  Electroplating  Gold  Growth rate  Lead-free solders  Metallic films  Scanning electron microscopy  Semiconductor doping  Silver alloys  Silver metallography  Soldering  Substrates  Surface roughness  Ternary alloys  Thermal aging  Tin alloys  Tin compounds  Tin metallography  X ray photoelectron spectroscopy  Benzotriazole(BTA)  Electroplated Cu films  Heterocyclic compound  Interfacial microstructure evolution  Isothermal aging  Kovar substrates  Low concentrations  Soldering process   Investigations on elastic properties and electronic structures of alpha-CoSn3 doped with Ni via first-principles calculations and nano-indentation measurements 期刊论文 RESULTS IN PHYSICS, 2019, 卷号: 15 作者:  Bi, Xiaoyang;  Hu, Xiaowu;  Li, Qinglin 收藏  |  浏览/下载：8/0  |  提交时间：2022/03/01 Intermetallic compound  Nano-indentation  First-principles calculations  Mechanical properties   The effects of Ni addition on microstructure evolution and mechanical properties of solder joints undergoing solid-liquid electromigration 期刊论文 MATERIALS LETTERS, 2019, 卷号: 256 作者:  Qiu, Hongyu;  Hu, Xiaowu;  Jiang, Xiongxin;  Li, Qinglin 收藏  |  浏览/下载：14/0  |  提交时间：2019/11/15 Grain orientation  Electromigration  Intermetallic compounds  Diffusion   fDiscovery of pyrazole-thiophene derivatives as highly Potent, orally active Akt inhibitors 期刊论文 EUROPEAN JOURNAL OF MEDICINAL CHEMISTRY, 2019, 卷号: 180, 页码: 72-85 作者:  Zhan, Wenhu;  Che, Jinxin;  Xu, Lei;  Wu, Yizhe;  Hu, Xiaobei 收藏  |  浏览/下载：15/0  |  提交时间：2020/07/01 Pyrazole-thiophene derivatives  Akt inhibitor  Antitumor   Shear strength and fracture behavior of solder/Kovar joints with electroplated Cu film 期刊论文 VACUUM, 2019, 卷号: 167, 页码: 428-437 作者:  Hu, Xiaowu;  Bao, Nifa;  Li, Qinglin 收藏  |  浏览/下载：11/0  |  提交时间：2019/11/15 Shear strength  Electroplated Cu  Aging  Kovar alloy  Microstructure   Insights on interfacial IMCs growth and mechanical strength of asymmetrical Cu/SAC305/Cu-Co system 期刊论文 VACUUM, 2019, 卷号: 167, 页码: 77-89 作者:  Hu, Xiaowu;  Li, Chao;  Li, Qinglin;  Yi, Guangbin 收藏  |  浏览/下载：5/0  |  提交时间：2019/11/15 SAC305 lead-free solders  Interfacial reaction  Intermetallic compound  Shear strength  Fracture   Theoretical and experimental investigations on mechanical properties of Co1-xNixSn2 intermetallic compounds 期刊论文 RESULTS IN PHYSICS, 2019, 卷号: 14 作者:  Bi, Xiaoyang;  Hu, Xiaowu;  Li, Qinglin;  Li, Yulong 收藏  |  浏览/下载：8/0  |  提交时间：2019/11/15 Intermetallic compounds  Ni additions  Nano-indentation  First-principles calculations  Mechanical properties   Discovery of 3,4,6-Trisubstituted Piperidine Derivatives as Orally Active, Low hERG Blocking Akt Inhibitors via Conformational Restriction and Structure-Based Design 期刊论文 JOURNAL OF MEDICINAL CHEMISTRY, 2019, 卷号: 62, 期号: 15, 页码: 7264-7288 作者:  Dong, Xiaowu;  Zhan, Wenhu;  Zhao, Mengting;  Che, Jinxin;  Dai, Xiaoyang 收藏  |  浏览/下载：30/0  |  提交时间：2020/07/01 Influence of Ni and Cu electrodeposits on the interfacial reaction between SAC305 solder and the Bi2(Te,Se)3 thermoelectric material 期刊论文 Journal of Materials Science: Materials in Electronics, 2019, 卷号: 30, 期号: 15, 页码: 14791-14804 作者:  Cheng, Jinxuan;  Hu, Xiaowu;  Li, Qinglin 收藏  |  浏览/下载：0/0  |  提交时间：2020/11/14 Crystal orientation  Deterioration  Electrodes  Substrates  Thermoelectric equipment  Aging treatment  Brittle failures  Cu electrodeposits  Interfacial contact  Isotropic microstructures  Solder joints  Spreadability  Thermo-Electric materials   Effects of aluminum addition (x=0-1 wt%) on the thermal behavior, microstructure and mechanical properties of Zn-30Sn high temperature lead-free solder alloy 期刊论文 MATERIALS RESEARCH EXPRESS, 2019, 卷号: 6, 期号: 8 作者:  Li, Jiayin;  Hu, Xiaowu;  Zhang, Xudong;  Li, Qinglin 收藏  |  浏览/下载：11/0  |  提交时间：2019/11/15 Zn-Sn alloys  mechanical properties  fracture analysis  microstructure refinement