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Reliability issues of lead-free solder joints in electronic devices 期刊论文
SCIENCE AND TECHNOLOGY OF ADVANCED MATERIALS, 2019, 卷号: 20, 期号: 1, 页码: 876-901
作者:  Jiang, Nan;  Zhang, Liang;  Liu, Zhi-Quan;  Sun, Lei;  Long, Wei-Min
收藏  |  浏览/下载:77/0  |  提交时间:2021/02/02
Structure and properties of Sn-Cu lead-free solders in electronics packaging 期刊论文
SCIENCE AND TECHNOLOGY OF ADVANCED MATERIALS, 2019, 卷号: 20, 期号: 1, 页码: 421-444
作者:  Zhao, Meng;  Zhang, Liang;  Liu, Zhi-Quan;  Xiong, Ming-Yue;  Sun, Lei
收藏  |  浏览/下载:130/0  |  提交时间:2021/02/02
Smart Materials and Design toward Safe and Durable Lithium Ion Batteries 期刊论文
SMALL METHODS, 2019, 卷号: 3, 期号: 11, 页码: 32
作者:  Wen, Lei;  Liang, Ji;  Chen, Jing;  Chu, Zheng-Yu;  Cheng, Hui-Ming
收藏  |  浏览/下载:18/0  |  提交时间:2021/02/02
Tunable In Situ Stress and Spontaneous Microwrinkling of Multiscale Heterostructures 期刊论文
JOURNAL OF PHYSICAL CHEMISTRY C, 2019, 卷号: 123, 期号: 43, 页码: 26041-26046
作者:  Chen, Jing;  Wen, Lei;  Liang, Ji;  Fang, Ruopian;  Chen, Long
收藏  |  浏览/下载:7/0  |  提交时间:2021/02/02
Dual-Additive Assisted Chemical Vapor Deposition for the Growth of Mn-Doped 2D MoS2 with Tunable Electronic Properties 期刊论文
SMALL, 2019, 页码: 9
作者:  Cai, Zhengyang;  Shen, Tianze;  Zhu, Qi;  Feng, Simin;  Yu, Qiangmin
收藏  |  浏览/下载:20/0  |  提交时间:2021/02/02
Influences of doping Ti nanoparticles on microstructure and properties of Sn58Bi solder 期刊论文
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2019, 卷号: 30, 期号: 19, 页码: 17583-17590
作者:  Jiang, Nan;  Zhang, Liang;  Liu, Zhi-quan;  Sun, Lei;  Xiong, Ming-yue
收藏  |  浏览/下载:13/0  |  提交时间:2021/02/02
Effect of residual hydrogen content on the tensile properties and crack propagation behavior of a type 316 stainless steel 期刊论文
INTERNATIONAL JOURNAL OF HYDROGEN ENERGY, 2019, 卷号: 44, 期号: 45, 页码: 25054-25063
作者:  Li Xiaobing;  Gao Ming;  Li Haoze;  Xing Weiwei;  Zhang Long
收藏  |  浏览/下载:17/0  |  提交时间:2021/02/02
Preparation of hierarchical trimetallic coordination polymer film as efficient electrocatalyst for oxygen evolution reaction 期刊论文
CHEMICAL COMMUNICATIONS, 2019, 卷号: 55, 期号: 63, 页码: 9343-9346
作者:  Bai, Xiao-Jue;  Li, Yu-Nong;  Yang, Xi-Man;  Zhang, Ming-Yu
收藏  |  浏览/下载:25/0  |  提交时间:2021/02/02
Microstructures and properties of SnAgCu lead-free solders bearing CuZnAl particles 期刊论文
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2019, 卷号: 30, 期号: 16, 页码: 15054-15063
作者:  Zhao, Meng;  Zhang, Liang;  Liu, Zhi-quan;  Xiong, Ming-yue;  Sun, Lei
收藏  |  浏览/下载:19/0  |  提交时间:2021/02/02
Microstructures and properties of SnAgCu lead-free solders bearing CuZnAl particles 期刊论文
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2019, 卷号: 30, 期号: 16, 页码: 15054-15063
作者:  Zhao, Meng;  Zhang, Liang;  Liu, Zhi-quan;  Xiong, Ming-yue;  Sun, Lei
收藏  |  浏览/下载:23/0  |  提交时间:2021/02/02


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