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浏览/检索结果: 共9条，第1-9条 帮助 限定条件 发表日期：2014     已选(0)清除 条数/页：5101520253035404550556065707580859095100   排序方式：请选择作者升序作者降序题名升序题名降序发表日期升序发表日期降序提交时间升序提交时间降序 Solder joint imagery compressing and recovery based on compressive sensing 期刊论文 Soldering and Surface Mount Technology, 2014, 卷号: 26, 期号: 3, 页码: 129-138 作者:  Zhao, Huihuang*;  Wang, Yaonan;  Qiao, Zhijun;  Fu, Bin 收藏  |  浏览/下载：13/0  |  提交时间：2019/12/24 Assembly  Solder joints  Solder  Pin-in-paste   Solder joint imagery compressing and recovery based on compressive sensing 期刊论文 Soldering & Surface Mount Technology, 2014, 卷号: 26, 期号: 3, 页码: 129-138 作者:  Zhao, Huihuang*;  Wang, Yaonan;  Qiao, Zhijun;  Fu, Bin 收藏  |  浏览/下载：4/0  |  提交时间：2019/12/24 Assembly  Solder joints  Solder  Pin-in-paste   A two-stage optimization algorithm of logistics transportation network 会议论文 International Conference on Sensors, Mechatronics and Automation (ICSMA), Shenzhen, PEOPLES R CHINA, DEC 24-25, 2013 作者:  Wei, Shudi*;  Hui, Wang;  Zhao, Huihuang 收藏  |  浏览/下载：4/0  |  提交时间：2019/12/24 Transport network  AHP algorithm  Dynamic programming   一种改进的微组装焊点三维重建算法 期刊论文 焊接学报, 2014, 卷号: 35, 期号: 8, 页码: 30-34,42 作者:  Zhao, Huihuang*;  Wang, Yaonan;  Sun, Yaqi;  Wei, Shudi 收藏  |  浏览/下载：5/0  |  提交时间：2019/12/24 焊点  微电子组装  三维重建  阴影恢复形状算法   An improved three-dimensional reconstruction algorithm for microelectronics assembly solder joint 期刊论文 Hanjie Xuebao/Transactions of the China Welding Institution, 2014, 卷号: Vol.35 No.8, 页码: 30-34,42 作者:  Zhao, Huihuang;  Wang, Yaonan;  Sun, Yaqi;  Wei, Shudi 收藏  |  浏览/下载：6/0  |  提交时间：2019/12/31 An improved three-dimensional reconstruction algorithm for microelectronics assembly solder joint 期刊论文 Transactions of the China Welding Institution, 2014, 卷号: Vol.35 No.8, 页码: 30-34,42 作者:  Zhao, Huihuang;  Wang, Yaonan;  Sun, Yaqi;  Wei, Shudi 收藏  |  浏览/下载：2/0  |  提交时间：2019/12/31 An improved three-dimensional reconstruction algorithm for microelectronics assembly solder joint 期刊论文 Transactions of the China Welding Institution, 2014, 卷号: Vol.35 No.8, 页码: 30-34,42 作者:  Zhao, Huihuang;  Wang, Yaonan;  Sun, Yaqi;  Wei, Shudi 收藏  |  浏览/下载：4/0  |  提交时间：2019/12/31 Solder joint imagery compressing and recovery based on compressive sensing 期刊论文 Soldering and Surface Mount Technology, 2014, 卷号: Vol.26 No.3, 页码: 129-138 作者:  Zhao, Huihuang;  Wang, Yaonan;  Qiao, Zhijun;  Fu, Bin 收藏  |  浏览/下载：6/0  |  提交时间：2019/12/31 Solder joint imagery compressing and recovery based on compressive sensing 期刊论文 Soldering and Surface Mount Technology, 2014, 卷号: Vol.26 No.3, 页码: 129-138 作者:  Zhao, Huihuang;  Wang, Yaonan;  Qiao, Zhijun;  Fu, Bin 收藏  |  浏览/下载：5/0  |  提交时间：2019/12/31 Assembly  Pin-in-paste  Solder  Solder joints