| Solder joint imagery compressing and recovery based on compressive sensing | |
| Zhao, Huihuang*; Wang, Yaonan; Qiao, Zhijun; Fu, Bin | |
| 刊名 | Soldering & Surface Mount Technology
 |
| 2014 | |
| 卷号 | 26期号:3页码:129-138 |
| 关键词 | Assembly Solder joints Solder Pin-in-paste |
| ISSN号 | 0954-0911 |
| DOI | 10.1108/SSMT-09-2013-0024 |
| URL标识 | 查看原文 |
| WOS记录号 | WOS:000342050700004;EI:20151600750265 |
| 内容类型 | 期刊论文 |
| URI标识 | http://www.corc.org.cn/handle/1471x/5282914 |
| 专题 | 衡阳师范学院 |
| 作者单位 | 1.[Zhao, Huihuang 2.Wang, Yaonan] Hunan Univ, Coll Elect & Informat Engn, Changsha 410082, Hunan, Peoples R China. |
| 推荐引用方式 GB/T 7714 | Zhao, Huihuang*,Wang, Yaonan,Qiao, Zhijun,et al. Solder joint imagery compressing and recovery based on compressive sensing[J]. Soldering & Surface Mount Technology,2014,26(3):129-138. |
| APA | Zhao, Huihuang*,Wang, Yaonan,Qiao, Zhijun,&Fu, Bin.(2014).Solder joint imagery compressing and recovery based on compressive sensing.Soldering & Surface Mount Technology,26(3),129-138. |
| MLA | Zhao, Huihuang*,et al."Solder joint imagery compressing and recovery based on compressive sensing".Soldering & Surface Mount Technology 26.3(2014):129-138. |
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