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Homogenization model based on micropolar theory for the interconnection layer in microsystem packaging 会议论文
2006 Conference on High Density Microsystem Design and Packaging and Component Failure Analysis, HDP'06, 2006-06-27
作者:  Zhang, Yan[1];  Larsson, Ragnar[2];  Fan, Jing-yu[3];  Cheng, Zhaonian[4];  Liu, Johan[5]
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