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A new method for reducing warpage due to reflow in IGBT module 会议论文
作者:  Zhou, Yang;  Xu, Ling;  Wang, Miao-cao;  Qian, Zhengfang;  Liu, Sheng
收藏  |  浏览/下载:3/0  |  提交时间:2019/12/05
A new method for reducing warpage due to reflow in IGBT module 期刊论文
16th International Conference on Electronic Packaging Technology, ICEPT 2015, 2015
作者:  Zhou, Yang;  Xu, Ling;  Wang, Miao-Cao;  Qian, Zhengfang;  Liu, Sheng
收藏  |  浏览/下载:1/0  |  提交时间:2019/12/05
Optimization for warpage and residual stress due to reflow process in IGBT modules based on pre-warped substrate 期刊论文
MICROELECTRONIC ENGINEERING, 2015, 卷号: 136
作者:  Zhou, Yang;  Xu, Ling;  Liu, Sheng
收藏  |  浏览/下载:3/0  |  提交时间:2019/12/05
Influence of warpage on the state estimation of a MEMS-based gyro-free inertial measurement unit 期刊论文
Proceedings of the Electronic Packaging Technology Conference, EPTC, 2014
作者:  Yu, Shuai;  Liu, Chaojun;  Zhang, Shengzhi;  Yuan, Xuebing;  Dan, Qiang
收藏  |  浏览/下载:3/0  |  提交时间:2019/12/05
Effect of Micro-Channel on Warpage and Residual Stress Due to Reflow Process in IGBT Modules 会议论文
作者:  Liu, Sheng;  Zhang, Ze-feng;  Xu, Ling;  Zhou, Yang
收藏  |  浏览/下载:1/0  |  提交时间:2019/12/05
Influence of Warpage on the State Estimation of a MEMS-Based Gyro-Free Inertial Measurement Unit 会议论文
作者:  Yu, Shuai;  Liu, Chaojun;  Zhang, Shengzhi;  Yuan, Xuebing;  Dan, Qiang
收藏  |  浏览/下载:4/0  |  提交时间:2019/12/05
Simulations for the Impact of Warpage on the Accuracy of Attitude and Heading Reference System 会议论文
作者:  Zhang, Shengzhi;  Dan, Qiang;  Liu, Chaojun;  Xu, Yong;  Wu, Xin
收藏  |  浏览/下载:3/0  |  提交时间:2019/12/05
Simulations for the impact of warpage on the accuracy of attitude and heading reference system 期刊论文
Proceedings - Electronic Components and Technology Conference, 2014
作者:  Zhang, Shengzhi;  Dan, Qiang;  Liu, Chaojun;  Xu, Yong;  Wu, Xin
收藏  |  浏览/下载:2/0  |  提交时间:2019/12/05


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