| Effect of Micro-Channel on Warpage and Residual Stress Due to Reflow Process in IGBT Modules | |
| Liu, Sheng; Zhang, Ze-feng; Xu, Ling; Zhou, Yang | |
| 2014 | |
| 关键词 | IGBT micro-channel reflow warpage |
| 收录类别 | CPCI-S |
| 会议录 | 2014 15TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT)
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| 语种 | 英语 |
| URL标识 | 查看原文 |
| 内容类型 | 会议论文 |
| URI标识 | http://www.corc.org.cn/handle/1471x/3744386 |
| 专题 | 武汉大学 |
| 推荐引用方式 GB/T 7714 | Liu, Sheng,Zhang, Ze-feng,Xu, Ling,et al. Effect of Micro-Channel on Warpage and Residual Stress Due to Reflow Process in IGBT Modules[C]. 见:. |
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