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Machine-Thermal Coupling Stresses Analysis of the Fin-Type Structural Thermoelectric Generator (EI收录) 期刊论文
Journal of Electronic Materials, 2017, 卷号: 46, 页码: 3156-3165
作者:  Zhang, Zheng[1];  Yue, Hao[2];  Chen, Dongbo[3];  Qin, Delei[3];  Chen, Zijian[1]
收藏  |  浏览/下载:4/0  |  提交时间:2019/04/24
The influence of sintering temperature and pressure on microstructure and mechanical properties of carbonyl iron powder materials fabricated by electric current activated sintering (EI收录) 期刊论文
Vacuum, 2017, 卷号: 137, 页码: 137-147
作者:  Ye, Yongquan[1,2];  Li, Xiaoqiang[2];  Cheng, Zhun[2];  Zhang, Minai[2];  Qu, Shengguan[2]
收藏  |  浏览/下载:120/0  |  提交时间:2019/04/24
Research on thermal-electric coupling effect of the copper pillar bump in the flip chip packaging (EI收录) 会议
Wuhan, China,
作者:  Fu, Zhiwei[1,2];  Zhou, Bin[1,2];  Yao, Ruohe[1];  Li, Xunping[2]
收藏  |  浏览/下载:1/0  |  提交时间:2019/04/11
Analysis of temperature and residual stress distribution in laser welding for Ta/Mo lap joints using FEM (EI收录) 会议论文
Advanced Materials Research, Harbin, China, September 21, 2013 - September 22, 2013
作者:  Jin, Liang[1];  Song, Fang Fang[2];  Wei, Guo Qiang[1];  Guo, Qi[1]
收藏  |  浏览/下载:1/0  |  提交时间:2019/04/15


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