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CORC

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Endurance of lead-free assembly under board level drop test and thermal cycling 期刊论文
JOURNAL OF ALLOYS AND COMPOUNDS, 2008, 卷号: 457, 期号: 1-2, 页码: 198-203
Xia, YH; Me, XM
收藏  |  浏览/下载：23/0  |  提交时间：2012/03/24
Study on Void Growth in Micro-Size SnAg Solder Bump 期刊论文
RARE METAL MATERIALS AND ENGINEERING, 2008, 卷号: 37, 期号: 11, 页码: 1903-1907
Lin, XQ; Luo, L
收藏  |  浏览/下载：18/0  |  提交时间：2012/03/24
The growth and influencing factors of voids in SnAg solder bump and their impact on interfacial bond strength 期刊论文
ICEPT: 2007 8TH INTERNATIONAL CONFERENCE ON ELECTRONICS PACKAGING TECHNOLOGY, PROCEEDINGS, 2007, 页码: 385-389
Lin, XQ; Luo, L
收藏  |  浏览/下载：17/0  |  提交时间：2012/03/24
Electromigration in Al interconnects and the challenges in ultra-deep submicron technology 期刊论文
ACTA PHYSICA SINICA, 2006, 卷号: 55, 期号: 10, 页码: 5424-5434
Zhang, WJ(张文杰）; Yi, WB（易万兵）; Wu, J（吴瑾）
收藏  |  浏览/下载：12/0  |  提交时间：2012/03/24
Mechanical properties of arrayed Pb-free tin bump and its interfacial reaction with Ni-PUBM during reflow process 期刊论文
ICEPT: 2006 7th International Conference on Electronics Packaging Technology, Proceedings, 2006, 页码: 51-54
Zhu, DP; Le, L
收藏  |  浏览/下载：13/0  |  提交时间：2012/03/24
Degradation of Sn-Ag-Cu heat-sink attachment during thermal shock cycling 期刊论文
SOLDERING & SURFACE MOUNT TECHNOLOGY, 2005, 卷号: 17, 期号: 4, 页码: 10-16
Chang, JL; Janz, D; Kempe, W; Xie, XM
收藏  |  浏览/下载：15/0  |  提交时间：2012/03/24
The growth behavior of Cu-Sn intermetallic compounds during aging 期刊论文
RARE METAL MATERIALS AND ENGINEERING, 2005, 卷号: 34, 页码: 332-335
Chang, JL; Janz, D; Liu, XQ; Yu, LH; Xie, XM
收藏  |  浏览/下载：10/0  |  提交时间：2012/03/24
On the formation of Cu-Ni-Sn ternary intermetallics in SNIT solder joints 期刊论文
PROCEEDINGS OF THE SIXTH IEEE CPMT CONFERENCE ON HIGH DENSITY MICROSYSTEM DESIGN AND PACKAGING AND COMPONENT FAILURE ANALYSIS (HDP'04), 2004, 页码: 66-69
Chang, JL; Xia, YH; Xie, XM
收藏  |  浏览/下载：18/0  |  提交时间：2012/03/24
Research of underfill delamination in flip chip by the J-integral method 期刊论文
JOURNAL OF ELECTRONIC PACKAGING, 2004, 卷号: 126, 期号: 1, 页码: 94-99
Xu, BL; Cai, X; Huang, WD; Cheng, ZN
收藏  |  浏览/下载：22/0  |  提交时间：2012/03/24
Lifetime of solder joint and delamination in flip chip assemblies 期刊论文
2004 INTERNATIONAL CONFERENCE ON THE BUSINESS OF ELECTRONIC PRODUCT RELIABILITY AND LIABILITY, PROCEEDINGS, 2004, 页码: 174-186
Cheng, ZN
收藏  |  浏览/下载：29/0  |  提交时间：2012/03/24

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