Study on Void Growth in Micro-Size SnAg Solder Bump

	Study on Void Growth in Micro-Size SnAg Solder Bump
	Lin, XQ ; Luo, L
刊名	RARE METAL MATERIALS AND ENGINEERING
	2008
卷号	37 期号:11 页码:1903-1907
关键词	EUTECTIC SNPB TIN-LEAD JOINTS CU RELIABILITY EVOLUTION COPPER MICROSTRUCTURE INTERMETALLICS TECHNOLOGY
ISSN号	1002-185X
通讯作者	Lin, XQ, Chinese Acad Sci, Shanghai Inst Microsyst & Informat Technol, Shanghai 200050, Peoples R China
学科主题	Materials Science, Multidisciplinary; Metallurgy & Metallurgical Engineering
收录类别	SCI
语种	中文
公开日期	2012-03-24
内容类型	期刊论文
源URL	[http://ir.sim.ac.cn/handle/331004/94990]
专题	上海微系统与信息技术研究所_功能材料与器件_期刊论文
推荐引用方式 GB/T 7714	Lin, XQ,Luo, L. Study on Void Growth in Micro-Size SnAg Solder Bump[J]. RARE METAL MATERIALS AND ENGINEERING,2008,37(11):1903-1907.
APA	Lin, XQ,&Luo, L.(2008).Study on Void Growth in Micro-Size SnAg Solder Bump.RARE METAL MATERIALS AND ENGINEERING,37(11),1903-1907.
MLA	Lin, XQ,et al."Study on Void Growth in Micro-Size SnAg Solder Bump".RARE METAL MATERIALS AND ENGINEERING 37.11(2008):1903-1907.