CORC

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CORC

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Interfacial reactions at Ga-21.5In-10Sn/Cu liquid-solid interfaces under isothermal and non-isothermal conditions 期刊论文
MATERIALS CHEMISTRY AND PHYSICS, 2022, 卷号: 282, 页码: 16
作者:  Gao, Zhaoqing;  Wang, Chen;  Chai, Zhenbang;  Chen, Yinbo;  Shen, Chenyu
收藏  |  浏览/下载：25/0  |  提交时间：2022/07/14
Fabrication of Ni-P coating film on diamond/Al composite and its soldering reliability 期刊论文
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2018, 卷号: 29, 期号: 10, 页码: 8371-8379
作者:  Shi, QY;  Liu, ZQ;  Wu, D;  Zhang, H;  Ni, DR
收藏  |  浏览/下载：30/0  |  提交时间：2018/06/05
Cu/SnAgCu/Cu TLP with different thicknesses for 3D IC 期刊论文
SOLDERING & SURFACE MOUNT TECHNOLOGY, 2017, 卷号: 29, 期号: 3, 页码: 151-155
作者:  Zhang, Liang;  Liu, Zhi-quan;  Yang, Fan;  Zhong, Su-juan
收藏  |  浏览/下载：23/0  |  提交时间：2021/02/02
Growth mechanism of duplex structural Cu-2(In,Sn) compound on single crystalline Cu substrate 期刊论文
Journal of Alloys and Compounds, 2014, 卷号: 588, 页码: 662-667
F. F. Tian; Z. Q. Liu
收藏  |  浏览/下载：34/0  |  提交时间：2014/03/14
Tin Whisker Growth on the Surface of Sn-0.7Cu Lead-Free Solder with a Rare Earth (Nd) Addition 期刊论文
Journal of Electronic Materials, 2009, 卷号: 38, 期号: 11, 页码: 2353-2361
M. Liu; A. P. Xian
收藏  |  浏览/下载：15/0  |  提交时间：2012/04/13
Oxidation behavior of molten tin doped with phosphorus 期刊论文
Journal of Electronic Materials, 2007, 卷号: 36, 期号: 12, 页码: 1669-1678
A. P. Xian; G. L. Gong
收藏  |  浏览/下载：10/0  |  提交时间：2012/04/13

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