Tin Whisker Growth on the Surface of Sn-0.7Cu Lead-Free Solder with a Rare Earth (Nd) Addition

CORC > 金属研究所 > 中国科学院金属研究所

	Tin Whisker Growth on the Surface of Sn-0.7Cu Lead-Free Solder with a Rare Earth (Nd) Addition
	M. Liu ; A. P. Xian
刊名	Journal of Electronic Materials
	2009
卷号	38 期号:11 页码:2353-2361
关键词	Sn Nd alloy soldering crystal growth microstructure alloys
ISSN号	0361-5235
中文摘要	The phenomenon of rare earth (RE) additions inducing whisker growth in Sn-0.7Cu-Nd (0.1-5 wt.%Nd) solder is reported. The results showed that Nd exists as Sn(3)Nd in the microstructure of the solder alloys. A snowflake-like Sn(3)Nd was observed when Nd a parts per thousand currency sign 0.5 wt.%. After exposure to ambient conditions, the Nd-bearing alloys have a strong tendency toward whisker growth, with a short incubation time for whisker nucleation (only several hours). All whiskers originated from the Sn-Nd compound, where whiskers grew relatively fast; the average growth rate of the five longest whiskers was approximately 4 /s, and a 190 mu m whisker was observed within 480 h. Based on these results, it was predicted that whisker growth would be inevitable for all RE-bearing solders. The cause of this phenomenon is also discussed. Finally, the authors suggest that any solders doped with RE should be carefully considered again.
原文出处	://WOS:000270634800020
公开日期	2012-04-13
内容类型	期刊论文
源URL	[http://ir.imr.ac.cn/handle/321006/32099]
专题	金属研究所_中国科学院金属研究所
推荐引用方式 GB/T 7714	M. Liu,A. P. Xian. Tin Whisker Growth on the Surface of Sn-0.7Cu Lead-Free Solder with a Rare Earth (Nd) Addition[J]. Journal of Electronic Materials,2009,38(11):2353-2361.
APA	M. Liu,&A. P. Xian.(2009).Tin Whisker Growth on the Surface of Sn-0.7Cu Lead-Free Solder with a Rare Earth (Nd) Addition.Journal of Electronic Materials,38(11),2353-2361.
MLA	M. Liu,et al."Tin Whisker Growth on the Surface of Sn-0.7Cu Lead-Free Solder with a Rare Earth (Nd) Addition".Journal of Electronic Materials 38.11(2009):2353-2361.