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大连理工大学 [185]
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期刊论文 [99]
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专题:大连理工大学
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Physically-based modeling of pad-asperity scale chemical-mechanical synergy in chemical mechanical polishing
期刊论文
TRIBOLOGY INTERNATIONAL, 2019, 卷号: 138, 页码: 307-315
作者:
Wang, Lin
;
Zhou, Ping
;
Yan, Ying
;
Kang, Renke
;
Guo, Dongming
收藏
  |  
浏览/下载:7/0
  |  
提交时间:2019/12/02
CMP
Pad asperity
Material removal rate
Chemical-mechanical synergy
Development of novel guar gum hydrogel based media for abrasive flow machining: Shear-thickening behavior and finishing performance
期刊论文
INTERNATIONAL JOURNAL OF MECHANICAL SCIENCES, 2019, 卷号: 157, 页码: 758-772
作者:
Wei, Haibo
;
Gao, Hang
;
Wang, Xuyue
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  |  
浏览/下载:18/0
  |  
提交时间:2019/12/02
Abrasive flow machining
Guar gum hydrogel
Shear-thickening media
Fine polishing
Complex shaped components
Investigation on Material Removal Uniformity in Electrochemical Mechanical Polishing by Polishing Pad with Holes
期刊论文
ECS JOURNAL OF SOLID STATE SCIENCE AND TECHNOLOGY, 2019, 卷号: 8, 页码: P3047-P3052
作者:
Liu, Zuotao
;
Jin, Zhuji
;
Wu, Di
;
Guo, Jiang
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  |  
浏览/下载:4/0
  |  
提交时间:2019/12/02
Insights into the atomistic behavior in diamond chemical mechanical polishing with center dot OH environment using ReaxFF molecular dynamics simulation
期刊论文
COMPUTATIONAL MATERIALS SCIENCE, 2019, 卷号: 166, 页码: 136-142
作者:
Shi, Zhuoying
;
Jin, Zhuji
;
Guo, Xiaoguang
;
Yuan, Song
;
Guo, Jiang
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  |  
浏览/下载:5/0
  |  
提交时间:2019/12/02
Diamond
Chemical mechanical polishing
Removal mechanism
Molecular dynamics simulation
ReaxFF
On the reaction mechanism of a hydroxyethylidene diphosphonic acid-based electrolyte for electrochemical mechanical polishing of copper
期刊论文
ELECTROCHEMISTRY COMMUNICATIONS, 2019, 卷号: 103, 页码: 48-54
作者:
Wu, Di
;
Kang, Renke
;
Guo, Jiang
;
Liu, Zuotao
;
Wan, Ce
收藏
  |  
浏览/下载:3/0
  |  
提交时间:2019/12/02
Hydroxyethylidene diphosphonic acid
Electrochemical mechanical polishing
Copper
Reaction mechanism
Polishing technique for KDP crystal based on two-phase air-water fluid
期刊论文
PRECISION ENGINEERING-JOURNAL OF THE INTERNATIONAL SOCIETIES FOR PRECISION ENGINEERING AND NANOTECHNOLOGY, 2019, 卷号: 56, 页码: 404-411
作者:
Liu, Ziyuan
;
Gao, Hang
;
Guo, Dongming
收藏
  |  
浏览/下载:3/0
  |  
提交时间:2019/12/02
Two-phase air-water fluid
Controllable deliquescence
Precision polishing
KDP crystal
Material removal
Surface planarization
Precision Fabrication of Thin Copper Substrate by Double-sided Lapping and Chemical Mechanical Polishing
期刊论文
JOURNAL OF MANUFACTURING PROCESSES, 2019, 卷号: 44, 页码: 47-54
作者:
Pan, Bo
;
Kang, Renke
;
Guo, Jiang
;
Fu, Haiyang
;
Du, Dongxing
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  |  
浏览/下载:42/0
  |  
提交时间:2019/12/02
Double-sided lapping
Chemical mechanical polishing
Flatness
Surface integrity
Residual stress
A Global Correction Process for Flat Optics with Patterned Polishing Pad
期刊论文
Journal of Manufacturing Science and Engineering, 2019, 页码: -
-
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浏览/下载:3/0
  |  
提交时间:2019/12/02
Effect of cupric ion concentration on the etching behavior of copper in Electrogenerated Chemical Polishing (EGCP)
期刊论文
PRECISION ENGINEERING-JOURNAL OF THE INTERNATIONAL SOCIETIES FOR PRECISION ENGINEERING AND NANOTECHNOLOGY, 2019, 卷号: 55, 页码: 70-76
作者:
Wang, Ke
;
Yan, Ying
;
Zhou, Ping
;
Shi, Kang
;
Guo, Dongming
收藏
  |  
浏览/下载:9/0
  |  
提交时间:2019/12/02
Electrogenerated chemical polishing
Roughness
Cupric ions
Apparent activation energy
Redox potential
Microstructure characterization of W-Ni-Fe heavy alloys with optimized metallographic preparation method
期刊论文
INTERNATIONAL JOURNAL OF REFRACTORY METALS & HARD MATERIALS, 2019, 卷号: 80, 页码: 114-122
作者:
Jiao, Zhenhua
;
Kang, Renke
;
Dong, Zhigang
;
Guo, Jiang
收藏
  |  
浏览/下载:6/0
  |  
提交时间:2019/12/02
Tungsten heavy alloy
Metallography
Microstructure
Polishing
Nanoindentation
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