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CORC

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Microstructure evolution of TC4 titanium alloy/316L stainless steel dissimilar joint vacuum-brazed with Ti-Zr-Cu amorphous filler metal 期刊论文
WELDING IN THE WORLD, 2019, 卷号: 63, 页码: 323-336
作者:  Xia, Yueqing;  Dong, Honggang;  Hao, Xiaohu;  Li, Shuai;  Li, Peng
收藏  |  浏览/下载：37/0  |  提交时间：2019/12/02
Acid-tolerant intermetallic cobalt-nickel silicides as noble metal-like catalysts for selective hydrogenation of phthalic anhydride to phthalide 期刊论文
CATALYSIS SCIENCE & TECHNOLOGY, 2019, 卷号: 9, 页码: 1108-1116
作者:  Zhang, Liangliang;  Chen, Xiao;  Chen, Yujing;  Peng, Zhijian;  Liang, Changhai
收藏  |  浏览/下载：31/0  |  提交时间：2019/12/02
Effects of electromigration on microstructural evolution and mechanical properties of preferential growth intermetallic compound interconnects for 3D packaging 会议论文
69th IEEE Electronic Components and Technology Conference, ECTC 2019, Las Vegas, NV, United states, 2019-05-28
作者:  Huang, Mingliang L.;  Zou, Lin
收藏  |  浏览/下载：9/0  |  提交时间：2019/12/02
Electromigration behavior and mechanical properties of the whole preferred orientation intermetallic compound interconnects for 3D packaging 会议论文
The 68th Electronic Components and Technology Conference
作者:  Huang ML(黄明亮);  Zou L(邹林);  Yin SQ(尹斯奇)
收藏  |  浏览/下载：3/0  |  提交时间：2019/12/02
Corrigendum to “On the increase of intermetallic compound's thickness at the cold side in liquid Sn and SnAg solders under thermal gradient” [Mater. Lett. 172(2016) 211-215] 期刊论文
Materials Letter, 2018, 卷号: 230, 页码: 76-76
作者:  A. Kunwar;  Ma HR(马浩然);  Ma HT(马海涛);  J.H. Sun;  Zhao N(赵宁)
收藏  |  浏览/下载：6/0  |  提交时间：2019/12/02
Corrigendum to “On the increase of intermetallic compound's thickness at the cold side in liquid Sn and SnAg solders under thermal gradient” [Mater. Lett. 172 (2016) 211–215] (S0167577X16302397) (10.1016/j.matlet.2016.02.075)) 期刊论文
Materials Letters, 2018, 卷号: 230, 页码: 76
作者:  Kunwar, A.;  Ma, H.;  Sun, J.;  Zhao, N.;  Huang, M.
收藏  |  浏览/下载：7/0  |  提交时间：2019/12/02
Growth mechanism of Cu3Sn grains in the (111)Cu/Sn/Cu micro interconnects 会议论文
2018 19TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2018-01-01
作者:  Zhong, Yi;  Zhao, Ning;  Dong, Wei;  Wang, Yunpeng;  Ma, Haitao
收藏  |  浏览/下载：4/0  |  提交时间：2019/12/02
Effect of Temperature Gradient on Interfacial Reactions in Cu/Sn-9Zn/Ni Solder Joints during Aging 会议论文
2018 19TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2018-01-01
作者:  Zhao, Ning;  Wang, Mingyao;  Zhong, Yi;  Ma, Haitao;  Wang, Yunpeng
收藏  |  浏览/下载：19/0  |  提交时间：2019/12/02
Size Effect of Interfacial Reaction in Sn-0.7Cu/Cu solder under Multiple Reflow 会议论文
2018 19TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2018-01-01
作者:  Huang, Ru;  Xia, Mengrou;  Yao, Jinye;  Wang, Boyin;  Qi, Xiao
收藏  |  浏览/下载：6/0  |  提交时间：2019/12/02
On the increase of intermetallic compound's thickness at the cold side in liquid Sn and SnAg solders under thermal gradient (vol 172, pg 211, 2016) 期刊论文
MATERIALS LETTERS, 2018, 卷号: 230, 页码: 76-76
作者:  Kunwar, Anil;  Ma, Haoran;  Ma, Haitao;  Sun, Junhao;  Zhao, Ning
收藏  |  浏览/下载：3/0  |  提交时间：2019/12/02

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