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浏览/检索结果: 共8条，第1-8条 帮助 限定条件 专题：兰州理工大学    第一署名单位    第一作者单位    通讯作者单位     已选(0)清除 条数/页：5101520253035404550556065707580859095100   排序方式：请选择作者升序作者降序题名升序题名降序发表日期升序发表日期降序提交时间升序提交时间降序 Analysis of rheological properties and micro-mechanism of aged and reclaimed asphalt based on multi-scales 期刊论文 CONSTRUCTION AND BUILDING MATERIALS, 2022, 卷号: 321 作者:  Lin, Mei;  Shuai, Jun;  Li, Ping;  Kang, Xiao;  Lei, Yu 收藏  |  浏览/下载：13/0  |  提交时间：2022/03/01 Reclaimed asphalt pavement  Rheological properties  Chemical components  Bee-like structure  Surface contact force   Influence of additives on electroplated copper films and shear strength of SAC305/Cu solder joints 期刊论文 JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2020, 卷号: 31, 期号: 3, 页码: 2320-2330 作者:  Zhang, Xudong;  Hu, Xiaowu;  Jiang, Xiongxin;  Zhou, Liuru;  Li, Qinglin 收藏  |  浏览/下载：14/0  |  提交时间：2020/06/16 Additives  Atomic force microscopy  Binary alloys  Chlorine compounds  Copper  Copper compounds  Electron probe microanalysis  Electrons  High resolution transmission electron microscopy  Metallic films  Scanning electron microscopy  Tin alloys  Tin metallography  X ray photoelectron spectroscopy  Crystallographic orientations  Electron back scatter diffraction  Electroplated copper film  Electroplated Cu films  Impurity incorporation  Micro-structural characterization  Microstructural instability  Plating solutions   Influence of benzotriazole on electroplated Cu films and interfacial microstructure evolution of solder joints 期刊论文 Journal of Materials Science: Materials in Electronics, 2019, 卷号: 30, 期号: 24, 页码: 21126-21137 作者:  Yi, Xiong;  Yi, Guangbin;  Hu, Xiaowu;  Li, Qinglin;  Zhang, Ruhua 收藏  |  浏览/下载：2/0  |  提交时间：2020/11/14 Atomic force microscopy  Coatings  Copper compounds  Electroplating  Gold  Growth rate  Lead-free solders  Metallic films  Scanning electron microscopy  Semiconductor doping  Silver alloys  Silver metallography  Soldering  Substrates  Surface roughness  Ternary alloys  Thermal aging  Tin alloys  Tin compounds  Tin metallography  X ray photoelectron spectroscopy  Benzotriazole(BTA)  Electroplated Cu films  Heterocyclic compound  Interfacial microstructure evolution  Isothermal aging  Kovar substrates  Low concentrations  Soldering process   Study on the kinetic model, thermodynamic and physicochemical properties of Glycyrrhiza polysaccharide by ultrasonic assisted extraction 期刊论文 ULTRASONICS SONOCHEMISTRY, 2019, 卷号: 51, 页码: 249-257 作者:  Wang, Yonggang;  Zhang, Xuan;  Ma, Xueqing;  Zhang, Kang;  Li, Shaowei 收藏  |  浏览/下载：9/0  |  提交时间：2019/11/15 Glycyrrhiza uralensis Fisch  Ultrasonic-assisted extraction  Kinetic model  Thermodynamics analysis  Physicochemical properties   Study on the kinetic model, thermodynamic and physicochemical properties of Glycyrrhiza polysaccharide by ultrasonic assisted extraction 期刊论文 Ultrasonics Sonochemistry, 2019, 卷号: 51, 页码: 249-257 作者:  Wang, Yonggang;  Zhang, Xuan;  Ma, Xueqing;  Zhang, Kang;  Li, Shaowei 收藏  |  浏览/下载：20/0  |  提交时间：2022/02/17 Antioxidants  Atomic force microscopy  Differential scanning calorimetry  Free energy  Gibbs free energy  Infrared spectroscopy  Kinetic parameters  Kinetic theory  Physicochemical properties  Scanning electron microscopy  Surface structure  Viscosity  Characteristic functions  Gibbs free energy changes  Glycyrrhiza uralensis Fisch  Kinetic modeling  Linear correlation coefficient  Thermodynamics analysis  Ultrasonic-assisted extractions  Ultraviolet spectrophotometry   Study on Tribological Properties of Antimony Nanoparticles as Liquid Paraffin Additive 期刊论文 JOURNAL OF TRIBOLOGY-TRANSACTIONS OF THE ASME, 2017, 卷号: 139, 期号: 5 作者:  Xu, Jianlin;  Yang, Shuhua;  Niu, Lei;  Liu, Xiaoqi;  Zhao, Jinqiang 收藏  |  浏览/下载：42/0  |  提交时间：2019/11/15 antimony nanoparticles  lubricant  additive  tribological properties   Effect of copper properties and bonding parameters on bonding quality 期刊论文 Cailiao Kexue yu Gongyi/Material Science and Technology, 2012, 卷号: 20, 期号: 4, 页码: 76-79 作者:  Cao, Jun;  Ding, Yu-Tian;  Guo, Ting-Biao 收藏  |  浏览/下载：0/0  |  提交时间：2020/11/14 Copper  Cracks  Elongation  Scanning electron microscopy  Surfaces  Bonding forces  Bonding parameters  Bonding power  Bonding strength  Effect of coppers  High-tensile strength  Large plastic deformation  Pad deformation   Effect of copper properties and bonding parameters on bonding quality 期刊论文 Cailiao Kexue yu Gongyi/Material Science and Technology, 2012, 卷号: 20, 期号: 4, 页码: 76-79 作者:  Cao, Jun;  Ding, Yu-Tian;  Guo, Ting-Biao 收藏  |  浏览/下载：15/0  |  提交时间：2022/02/17 Copper  Copper metallography  Cracks  Elongation  Scanning electron microscopy  Surfaces  Bonding forces  Bonding parameters  Bonding power  Bonding strength  Effect of coppers  High-tensile strength  Large plastic deformation  Pad deformation