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Study of microstructure and mechanical properties of Cu/In-45Cu/SiC joints connected by ultrasonic-assisted TLP 期刊论文
Microelectronics Reliability, 2022, 卷号: 135
作者:  Yu, Weiyuan;  Li, Binbin;  Wu, Baolei;  Wang, Fengfeng;  Wang, Mingkang
收藏  |  浏览/下载:18/0  |  提交时间:2022/08/09
Enhanced mechanical properties and corrosion behavior of Zn-30Sn-2Cu high-temperature lead-free solder alloy by adding Sm 期刊论文
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2022, 卷号: 33, 期号: 9, 页码: 6469-6484
作者:  Zhang, Huajin;  Hu, Xiaowu;  Liu, Yi;  Zhang, Jiankang;  Jiang, Xiongxin
收藏  |  浏览/下载:29/0  |  提交时间:2022/03/01
Effects of aluminum addition (x = 0-1 wt%) on the thermal behavior, microstructure and mechanical properties of Zn-30Sn high temperature lead-free solder alloy 期刊论文
Materials Research Express, 2019, 卷号: 6, 期号: 8
作者:  Li, Jiayin;  Hu, Xiaowu;  Zhang, Xudong;  Li, Qinglin
收藏  |  浏览/下载:0/0  |  提交时间:2020/11/14
High Frequency Induction Brazing Process of Copper-Steel and Its Effects on Microstructure and Electrical Conductivity of Weld Joint 期刊论文
Cailiao Daobao/Materials Review, 2018, 卷号: 32, 期号: 3, 页码: 909-914
作者:  Shi, Yu;  Gao, Haiming;  Li, Guang;  Li, Xiang
收藏  |  浏览/下载:0/0  |  提交时间:2020/11/14


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