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浏览/检索结果: 共13条，第1-10条 帮助 限定条件 专题：北京大学    第一署名单位    第一作者单位    通讯作者单位     已选(0)清除 条数/页：5101520253035404550556065707580859095100   排序方式：请选择作者升序作者降序题名升序题名降序发表日期升序发表日期降序提交时间升序提交时间降序 Medicinal plant diversity and traditional healing practices in eastern Nepal 期刊论文 JOURNAL OF ETHNOPHARMACOLOGY, 2016 Shrestha, Nawal; Shrestha, Saugat; Koju, Laxmi; Shrestha, Krishna Kumar; Wang, Zhiheng 收藏  |  浏览/下载：3/0  |  提交时间：2017/12/04 Ethnomedicine  Fidelity level  Himalayan medicine  Informant consensus factor  Sankhuwasabha  Tinjure-Milke-Jaljale  RASUWA DISTRICT  ETHNOBOTANY  COMMUNITIES  EXTRACT  REGION  ANTIOXIDANT  DISCOVERY  HIGHLANDS  VILLAGE  HUMLA   Reliability variability simulation methodology for IC design: An EDA perspective 其他 2016-01-01 Zhang, Aixi; Huang, Chunyi; Guo, Tianlei; Chen, Alvin; Guo, Shaofeng; Wang, Runsheng; Huang, Ru; Xie, Jushan 收藏  |  浏览/下载：4/0  |  提交时间：2017/12/03 Reliability and longer range for low power transmitters with on demand network MIMO 其他 2016-01-01 Weitnauer, Mary Ann; Lin, Qiongjie; Zhang, Huanyu; Tian, Hongxian; Nowlan, Sean; Nyengele, Gedeon; Chakkedath, Sajith Mohan; Slratigos, Jim 收藏  |  浏览/下载：2/0  |  提交时间：2017/12/03 Reliability and Longer Range for Low Power Transmitters with On Demand Network MIMO 其他 2016-01-01 Weitnauer, Mary Ann; Lin, Qiongjie; Zhang, Huanyu; Tian, Hongxian; Nowlan, Sean; Nyengele, Gedeon; Chakkedath, Sajith Mohan; Stratigos, Jim 收藏  |  浏览/下载：3/0  |  提交时间：2017/12/03 wireless sensor networks  successive interference cancellation  coordinated multipoint  network MIMO  SHANNON-THEORETIC APPROACH  MULTIPLE-ACCESS CHANNEL  ALOHA  INTERFERENCE  ARCHITECTURE  WIRELESS  SCHEME  CODES   Initial thermal stress and strain effects on thermal mechanical stability of through silicon via 期刊论文 MICROELECTRONIC ENGINEERING, 2016 Sun, Yunna; Sun, Shi; Zhang, Yazhou; Luo, Jiangbo; Wang, Yan; Ding, Guifu; Jin, Yufeng 收藏  |  浏览/下载：6/0  |  提交时间：2017/12/03 IC packaging and fabricating  Thermal load  Initial thermal stress and deformation  Thermal mechanical reliability  THROUGH-SILICON  FATIGUE  COPPER  TSV  VIAS   A Novel PUF based on Cell Error Rate Distribution of STT-RAM 其他 2016-01-01 Zhang, Xian; Sun, Guangyu; Zhang, Yaojun; Chen, Yiran; Li, Hai; Wen, Wujie; Di, Jia 收藏  |  浏览/下载：2/0  |  提交时间：2017/12/03 MEMORY   Thermal-Mechanical Reliability Assessment of TSV Structure for 3D IC Integration 其他 2016-01-01 Liu, Huan; Zeng, Qinghua; Guan, Yong; Fang, Runiu; Sun, Xin; Su, Fei; Chen, Jing; Miao, Min; Jin, Yufeng 收藏  |  浏览/下载：5/0  |  提交时间：2017/12/03 THROUGH-SILICON VIAS   Accelerated Aging in Analog and Digital Circuits With Feedback 期刊论文 IEEE TRANSACTIONS ON DEVICE AND MATERIALS RELIABILITY, 2015 Sutaria, Ketul B.; Mohanty, Abinash; Wang, Runsheng; Huang, Ru; Cao, Yu 收藏  |  浏览/下载：2/0  |  提交时间：2017/12/03 Circuit aging  bias runaway  BTI  CHC  DVS  aging models and simulation framework  BIAS TEMPERATURE INSTABILITY  HOT-CARRIER DEGRADATION  DEEP-SUBMICRON NMOSFETS  E-E SCATTERING  NBTI  RELIABILITY  SIMULATION  DESIGN  CROSS  MODEL   Reliability variability simulation methodology for IC design: an EDA perspective 其他 2015-01-01 Zhang, Aixi; Huang, Chunyi; Guo, Tianlei; Chen, Alvin; Guo, Shaofeng; Wang, Runsheng; Huang, Ru; Xie, Jushan 收藏  |  浏览/下载：1/0  |  提交时间：2017/12/03 Diagnosing bias runaway in analog/mixed signal circuits 其他 2014-01-01 Sutaria, Ketul B.; Ren, Pengpeng; Ramkumar, Athul; Zhu, Rongjun; Feng, Xixiang; Wang, Runsheng; Huang, Ru; Cao, Yu 收藏  |  浏览/下载：2/0  |  提交时间：2015/11/13