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CORC

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Structural characterization of the DNA-binding mechanism underlying the copper(II)-sensing MarR transcriptional regulator 其他
2017-01-01
Zhu, Rongfeng; Hao, Ziyang; Lou, Hubing; Song, Yanqun; Zhao, Jingyi; Chen, Yuqing; Zhu, Jiuhe; Chen, Peng R.
收藏  |  浏览/下载：4/0  |  提交时间：2017/12/03
农民工机会性与必要性创业的个人资本差异 其他
2016-08-01
任锋; REN Feng; 李树茁; LI Shu-zhuo; 刘玲睿; LIU Ling-rui
收藏  |  浏览/下载：5/0  |  提交时间：2016/09/08
Fabrication and Characterization of Low Stress Si Interposer with Air-gapped Si Interconnection for Hermetical System-in-Package 其他
2016-01-01
Luo, Rongfeng; Ren, Kuili; Ma, Shenglin; Yan, Jun; Xia, Yanming; Jin, Yufeng; Chen, Jing; Wu, Tianzhun; Yang, Hangao; Yuan, Lifang
收藏  |  浏览/下载：5/0  |  提交时间：2017/12/03
Process Development of a New TGV Interposer for Wafer Level Package of Inertial MEMS Device 其他
2016-01-01
Ma, Shenglin; Ren, Kuili; Xia, Yanming; Yan, Jun; Luo, Rongfeng; Cai, Han; Jin, Yufeng; Ma, Mingjun; Jin, Zhonghe; Chen, Jing
收藏  |  浏览/下载：6/0  |  提交时间：2017/12/03
Folding Differential Capacitive Accelerometer Made of LTCC 其他
2016-01-01
Qin Mingjie; Jin, Yufeng; Miao, Min; Tang Xiaoping; Lu Huixiang; Yan Yingzhan
收藏  |  浏览/下载：5/0  |  提交时间：2017/12/03
Low temperature multi-layer wafer level package for chip scale atomic clock (CSAC) 其他
2015-01-01
Li, Nannan; Zhang, Yangxi; Zhu, Ningli; Zhu, Yunhui; Gao, Chengchen; Chen, Jing
收藏  |  浏览/下载：7/0  |  提交时间：2017/12/03
Discussion and analysis of Au/a-Si contact resistance in MEMS/NEMS devices 其他
2015-01-01
Fu, Fengshan; Yang, Fang; Wang, Wei; Huang, Xian; He, Jun; Zhang, Li; Guan, Taotao; Li, Rui; Zhang, Dacheng
收藏  |  浏览/下载：5/0  |  提交时间：2017/12/03
BONDING-FRIENDLY PCPDMS: DEPOSITING PARYLENE C INTO PDMS MATRIX AT AN ELEVATED TEMPERATURE 其他
2015-01-01
Liu, Yaoping; Zhang, Lingqian; Wang, Wei; Wu, Wengang
收藏  |  浏览/下载：4/0  |  提交时间：2017/12/03
Silicon-silicon anodic bonding process with embedded glass 其他
2015-01-01
Cui, W.P.; Liu, G.D.; Zhang, F.S.; Hu, H.; Gao, C.C.; Hao, Y.L.
收藏  |  浏览/下载：2/0  |  提交时间：2017/12/03
High temperature pressure sensor using Cu-Sn wafer level bonding 其他
2015-01-01
Liu, G.D.; Gao, C.C.; Zhang, Y.X.; Hao, Y.L.
收藏  |  浏览/下载：3/0  |  提交时间：2017/12/03

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