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浏览/检索结果: 共9条，第1-9条 帮助 限定条件 内容类型：其他     已选(0)清除 条数/页：5101520253035404550556065707580859095100   排序方式：请选择作者升序作者降序题名升序题名降序发表日期升序发表日期降序提交时间升序提交时间降序 Reliability variability simulation methodology for IC design: An EDA perspective 其他 2016-01-01 Zhang, Aixi; Huang, Chunyi; Guo, Tianlei; Chen, Alvin; Guo, Shaofeng; Wang, Runsheng; Huang, Ru; Xie, Jushan 收藏  |  浏览/下载：4/0  |  提交时间：2017/12/03 Reliability and longer range for low power transmitters with on demand network MIMO 其他 2016-01-01 Weitnauer, Mary Ann; Lin, Qiongjie; Zhang, Huanyu; Tian, Hongxian; Nowlan, Sean; Nyengele, Gedeon; Chakkedath, Sajith Mohan; Slratigos, Jim 收藏  |  浏览/下载：2/0  |  提交时间：2017/12/03 Reliability and Longer Range for Low Power Transmitters with On Demand Network MIMO 其他 2016-01-01 Weitnauer, Mary Ann; Lin, Qiongjie; Zhang, Huanyu; Tian, Hongxian; Nowlan, Sean; Nyengele, Gedeon; Chakkedath, Sajith Mohan; Stratigos, Jim 收藏  |  浏览/下载：3/0  |  提交时间：2017/12/03 wireless sensor networks  successive interference cancellation  coordinated multipoint  network MIMO  SHANNON-THEORETIC APPROACH  MULTIPLE-ACCESS CHANNEL  ALOHA  INTERFERENCE  ARCHITECTURE  WIRELESS  SCHEME  CODES   A Novel PUF based on Cell Error Rate Distribution of STT-RAM 其他 2016-01-01 Zhang, Xian; Sun, Guangyu; Zhang, Yaojun; Chen, Yiran; Li, Hai; Wen, Wujie; Di, Jia 收藏  |  浏览/下载：2/0  |  提交时间：2017/12/03 MEMORY   Thermal-Mechanical Reliability Assessment of TSV Structure for 3D IC Integration 其他 2016-01-01 Liu, Huan; Zeng, Qinghua; Guan, Yong; Fang, Runiu; Sun, Xin; Su, Fei; Chen, Jing; Miao, Min; Jin, Yufeng 收藏  |  浏览/下载：5/0  |  提交时间：2017/12/03 THROUGH-SILICON VIAS   Reliability variability simulation methodology for IC design: an EDA perspective 其他 2015-01-01 Zhang, Aixi; Huang, Chunyi; Guo, Tianlei; Chen, Alvin; Guo, Shaofeng; Wang, Runsheng; Huang, Ru; Xie, Jushan 收藏  |  浏览/下载：1/0  |  提交时间：2017/12/03 Diagnosing bias runaway in analog/mixed signal circuits 其他 2014-01-01 Sutaria, Ketul B.; Ren, Pengpeng; Ramkumar, Athul; Zhu, Rongjun; Feng, Xixiang; Wang, Runsheng; Huang, Ru; Cao, Yu 收藏  |  浏览/下载：2/0  |  提交时间：2015/11/13 Preliminary validation of entransy-based thermal management for 3D IC 其他 2013-01-01 Pi, Yudan; Sun, Han; Huang, Jie; Wang, Wei; Chen, Jing; Jin, Yufeng; Cao, Bingyang 收藏  |  浏览/下载：3/0  |  提交时间：2015/11/13 3D IC  thermal management  entransy  optimal parameter  HEAT-TRANSFER   Groove structure for stress releasing around TSV 其他 2013-01-01 Sun, Han; Pi, Yudan; Wang, Wei; Chen, Jing; Jin, Yufeng 收藏  |  浏览/下载：2/0  |  提交时间：2015/11/13 TSV  Thermal stress  Stress-releasing Groove