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Ultra-wideband solar absorber based on refractory titanium metal 会议论文
作者:  Yu, Peiqi;  Yang, Hua;  Chen, Xifang;  Yi, Zao;  Yao, Weitang
收藏  |  浏览/下载：7/0  |  提交时间：2020/12/18
Unveiling the pinning behavior of charged domain walls in BiFeO3 thin films via vacancy defects 会议论文
作者:  Geng, W.R.;  Tian, X.H.;  Jiang, Y.X.;  Zhu, Y.L.;  Tang, Y.L.
收藏  |  浏览/下载：2/0  |  提交时间：2020/12/18
Residual and Dense UNet for Under-Display Camera Restoration 会议论文
Glasgow, United kingdom, August 23-28, 2020
作者:  Yang QR(杨琦瑞);  Liu, Yihao;  Tang, Jigang;  Ku T(库涛)
收藏  |  浏览/下载：5/0  |  提交时间：2021/03/14
A study on the oxygen plasma treatment on the peel adhesion strength and solder wettability of SnBi58 based anisotropic conductive films 会议论文
69th IEEE Electronic Components and Technology Conference, ECTC 2019, Las Vegas, NV, United states, 2019-05-28
作者:  Zhang, Shuye;  Huang, Mingliang;  Wu, Yang;  Yang, Ming;  Lin, Tiesong
收藏  |  浏览/下载：7/0  |  提交时间：2019/12/02
Design of integrated impeller processing fixture and force analysis of key parts 会议论文
2019 2nd International Conference on Advanced Electronic Materials, Computers and Materials Engineering, AEMCME 2019, Changsha, China, 2019-04-19
作者:  Liao, Longxing;  Gao, Peili;  Meng, Xiangdong;  Meng, Zhaohang;  Xie, Wenxiang
收藏  |  浏览/下载：12/0  |  提交时间：2019/12/02
Electromigration-induced -Sn grain rotation in lead-free flip chip solder bumps 会议论文
69th IEEE Electronic Components and Technology Conference, ECTC 2019, Las Vegas, NV, United states, 2019-05-28
作者:  Huang, Mingliang L.;  Kuang, Jiameng M.;  Sun, Hongyu Y.
收藏  |  浏览/下载：4/0  |  提交时间：2019/12/02
Effects of electromigration on microstructural evolution and mechanical properties of preferential growth intermetallic compound interconnects for 3D packaging 会议论文
69th IEEE Electronic Components and Technology Conference, ECTC 2019, Las Vegas, NV, United states, 2019-05-28
作者:  Huang, Mingliang L.;  Zou, Lin
收藏  |  浏览/下载：9/0  |  提交时间：2019/12/02
Research on modeling method of honeycomb plate and its application on solar wing 会议论文
Changsha, China, April 19-21, 2019
作者:  Luo HT(骆海涛);  Li, Yuxin;  Wang, Haonan;  Fu J(富佳)
收藏  |  浏览/下载：19/0  |  提交时间：2019/09/28
Tunable Mechanical Properties of Ti-Zr-Ni-Cr Amorphous Ribbons via Vanadium Addition 会议论文
JOURNAL OF ELECTRONIC MATERIALS, 2019-03-01
作者:  Jiang, Bing[1];  Wang, Jianxin[2];  Qian, Chengyuan[3];  Xu, Lingfeng[4];  Hou, Xueling[5]
收藏  |  浏览/下载：5/0  |  提交时间：2019/04/22
Improved Thermal Conductive Property of Pine Needle Derived Carbon for Thermal Management Applications 会议论文
20th International Conference on Electronic Materials and Packaging, EMAP 2018, Clear Water Bay, Hong kong, 2018-12-17
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收藏  |  浏览/下载：3/0  |  提交时间：2020/01/03

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