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| Initial Study of GaN Thin Films for Photocathodes Prepared by Magnetron Sputtering on Copper Substrates 会议论文
Brazil, 2021
作者: M. Vogel; X. Jiang, C. Wang
  收藏 | 浏览/下载：52/0 | 提交时间：2022/01/18 |
| Design of suppressing optical and recombination losses in ultrathin CuInGaSe2 solar cells by Voronoi nanocavity arrays 会议论文
作者: Wang, Yi-Chung; Chen, Chia-Wei; Su, Teng-Yu; Yang, Tzu-Yi; Liu, Wen-Wu
收藏 | 浏览/下载：16/0 | 提交时间：2020/12/18
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| Fabrication of Large-area MgB2 Films on Copper Substrates 会议论文
Lanzhou, China, 2017
作者: X.Guo; K.X.Liu; Z.Ni
收藏 | 浏览/下载：26/0 | 提交时间：2018/03/14 |
| Electroplating Fabrication and Characterization of Sn-Ag Eutectic Solder Films 会议论文
The 17th International Conference on electronic packing Technology (ICEPT 2016), Changsha,China
作者: Jinqi Xie; Zhe Zhong; Kai Zhang; Matthew M.F. Yuen; S.W. Ricky Lee
收藏 | 浏览/下载：21/0 | 提交时间：2017/01/15 |
| Facile Synthesis of Elliptical Cu-Ag Nanoplates forElectrically Conductive Adhesives 会议论文
The 16th International Conference on electronic packing Technology (ICEPT 2015), Changsha,China
作者: Yu Zhang; Pengli Zhu; Gang Li; Baotan Zhang; Rong Sun
收藏 | 浏览/下载：13/0 | 提交时间：2016/01/27 |
| Mechanical properties of locally oxidized graphene electrodes 会议论文
Hui, Fei; Shi, Yuanyuan; Ji, Yanfeng; Lanza, Mario; Duan, Huiling
收藏 | 浏览/下载：6/0 | 提交时间：2017/12/04
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| Dealloyed nanoporous Cu films on ceramic substrate for low temperature bonding 会议论文
作者: Liu, Sheng; Chen, Mingxiang; Li, Kecheng; Liu, Xiaogang
收藏 | 浏览/下载：3/0 | 提交时间：2019/12/05
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| Quantitative analysis of oxygen content in copper oxide films using ultra microbalance 会议论文
The 29th International Symposium on Rarefied Gas Dynamics, 中国陕西西安, 2014-07-13
作者: Shu YH(舒勇华) ; Liu C(刘崇); Wang LH(王连红); Fan J(樊菁)
收藏 | 浏览/下载：23/0 | 提交时间：2015/09/10
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| Atomic diffusion and interface reaction of Cu/Si (111) films prepared by ionized cluster beam deposition 会议论文
17th International Conference on Surface Modification of Materials by Ion Beams (SMMIB), Harbin, PEOPLES R CHINA, SEP 13-17, 2011
作者: Cao, B; Yang, TR; Li, GP; Cho, S; Kim, H
收藏 | 浏览/下载：3/0 | 提交时间：2017/01/20
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| A simple way to prepare large-scale copper nanoparticles for conductive ink in printed electronics 会议论文
2013 14th International Conference on Electronic Packaging Technology, ICEPT 2013, Dalian, China
作者: Zhang Yu; Zhu Pengli; Sun Rong; Wong Chingping
收藏 | 浏览/下载：18/0 | 提交时间：2015/08/27 |
