CORC

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CORC

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Effect of Ag element on microstructure and mechanical properties of Sn-Bi-xAg solders designed by cluster-plus-glue-atom model 会议论文
2018 19TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2018-01-01
作者:  Ren, Jing;  Huang, Mingliang;  Yang, Xudong
收藏  |  浏览/下载：2/0  |  提交时间：2019/12/02
Interfacial Reactions between Cu Single Crystals and Lead-free Solders during Solid-State Aging 会议论文
13th International Conference on Electronic Packaging Technology and High Density Packaging (ICEPT-HDP), Guilin, PEOPLES R CHINA, 2012-08-13
作者:  Liu, Ting;  Huang, Mingliang;  Zhao, Ning
收藏  |  浏览/下载：2/0  |  提交时间：2019/12/13
The study on the rapidly-solidified Sn-0.7Cu lead-free solders and the interface reactions with Cu substrate 会议论文
13th International Conference on Electronic Packaging Technology and High Density Packaging (ICEPT-HDP), Guilin, PEOPLES R CHINA, 2012-01-01
作者:  Ma, H. T.;  Wang, J.;  Qu, L.;  An, L. L.;  Gu, L. Y.
收藏  |  浏览/下载：3/0  |  提交时间：2019/12/13
The study on the rapidly-solidified Sn-0.7Cu lead-free solders and the interface reactions with Cu substrate 会议论文
2012 13th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2012, Guilin
作者:  Ma H.T.;  Wang J.;  Qu L.;  An L.L.;  Gu L.Y.
收藏  |  浏览/下载：1/0  |  提交时间：2019/12/18
Fabrication and properties of lead-free Sn-Ag-Cu-Ga solder alloy 会议论文
PRICM 5: THE FIFTH PACIFIC RIM INTERNATIONAL CONFERENCE ON ADVANCED MATERIALS AND PROCESSING, PTS 1-5, 5th Pacific Rim International Conference on Advanced Materials and Processing, Beijing, PEOPLES R CHINA, Web of Science
Chen, GH; Ma, JS; Geng, ZT
收藏  |  浏览/下载：3/0
The Correlation between the Liquid Structure and the Solidification Microstructure of Sn-Cu Lead-Free Solders 会议论文
7th Pacific Rim International Conference on Advanced Materials and Processing, Cairns, AUSTRALIA, 2010-08-02
作者:  Pan, Xuemin;  Zhao, Ning;  Ding, Ruifang;  Wei, Guanglin;  Wang, Lai
收藏  |  浏览/下载：2/0  |  提交时间：2019/12/24
The correlation between the liquid structure and the viscosity of Sn-Cu lead-free solders 会议论文
International Conference on Manufacturing Science and Engineering (ICMSE 2009), Zhuhai, PEOPLES R CHINA, 2009-12-26
作者:  Pan, Xuemin;  Zhao, Ning;  Ding, Ruifang;  Wei, Guanglin;  Wang, Lai
收藏  |  浏览/下载：2/0  |  提交时间：2019/12/24
Comparative Study of Interfacial Reactions of High-Sn Lead-free Solders on Single Crystal Cu and on Polycrystalline Cu 会议论文
International Conference on Electronic Packaging Technology & High Density Packaging, Beijing, PEOPLES R CHINA, 2009-08-10
作者:  Cui, Yipeng;  Huang, Mingliang
收藏  |  浏览/下载：1/0  |  提交时间：2019/12/24
The liquid structure of Sn-based lead-free solders and the correlative effect in liquid-solid interfacial reaction 会议论文
13th Conference on Liquid and Amorphous Metals, Ekaterinburg, RUSSIA, 2008-01-01
作者:  Zhao, Ning;  Pan, Xuemin;  Ma, Haitao;  Dong, Chuang;  Guo, Shuhong
收藏  |  浏览/下载：2/0  |  提交时间：2019/12/27
Microstructural evolution of Sn-Zn based lead free solders after temperature and humid atmosphere exposure 会议论文
2005 Conference on High Density Microsystem Design and Packaging and Component Failure Analysis, HDP'05, 2005-06-27
作者:  Sun, Peng[1];  Andersson, Cristina[2];  Wei, Xicheng[3];  Cheng, Zhaonian[4];  Shangguan, Dongkai[5]
收藏  |  浏览/下载：9/0  |  提交时间：2019/05/10

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