The study on the rapidly-solidified Sn-0.7Cu lead-free solders and the interface reactions with Cu substrate | |
Ma, H. T.; Wang, J.; Qu, L.; An, L. L.; Gu, L. Y.; Huang, M. L. | |
2012 | |
会议名称 | 13th International Conference on Electronic Packaging Technology and High Density Packaging (ICEPT-HDP) |
会议日期 | 2012-01-01 |
会议地点 | Guilin, PEOPLES R CHINA |
页码 | 360-364 |
会议录 | 13th International Conference on Electronic Packaging Technology and High Density Packaging (ICEPT-HDP)
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URL标识 | 查看原文 |
内容类型 | 会议论文 |
URI标识 | http://www.corc.org.cn/handle/1471x/4672427 |
专题 | 大连理工大学 |
作者单位 | Dalian Univ Technol, Sch Mat Sience & Engn, Dalian, Liaoning Provin, Peoples R China. |
推荐引用方式 GB/T 7714 | Ma, H. T.,Wang, J.,Qu, L.,et al. The study on the rapidly-solidified Sn-0.7Cu lead-free solders and the interface reactions with Cu substrate[C]. 见:13th International Conference on Electronic Packaging Technology and High Density Packaging (ICEPT-HDP). Guilin, PEOPLES R CHINA. 2012-01-01. |
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