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	The study on the rapidly-solidified Sn-0.7Cu lead-free solders and the interface reactions with Cu substrate
	Ma, H. T.; Wang, J.; Qu, L.; An, L. L.; Gu, L. Y.; Huang, M. L.
	2012
会议名称	13th International Conference on Electronic Packaging Technology and High Density Packaging (ICEPT-HDP)
会议日期	2012-01-01
会议地点	Guilin, PEOPLES R CHINA
页码	360-364
会议录	13th International Conference on Electronic Packaging Technology and High Density Packaging (ICEPT-HDP)
URL标识	查看原文
内容类型	会议论文
URI标识	http://www.corc.org.cn/handle/1471x/4672427
专题	大连理工大学
作者单位	Dalian Univ Technol, Sch Mat Sience & Engn, Dalian, Liaoning Provin, Peoples R China.
推荐引用方式 GB/T 7714	Ma, H. T.,Wang, J.,Qu, L.,et al. The study on the rapidly-solidified Sn-0.7Cu lead-free solders and the interface reactions with Cu substrate[C]. 见:13th International Conference on Electronic Packaging Technology and High Density Packaging (ICEPT-HDP). Guilin, PEOPLES R CHINA. 2012-01-01.

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