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Effect of Temperature Gradient on Interfacial Reactions in Cu/Sn-9Zn/Ni Solder Joints during Aging 会议论文
2018 19TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2018-01-01
作者:  Zhao, Ning;  Wang, Mingyao;  Zhong, Yi;  Ma, Haitao;  Wang, Yunpeng
收藏  |  浏览/下载：19/0  |  提交时间：2019/12/02
Size Effect of Interfacial Reaction in Sn-0.7Cu/Cu solder under Multiple Reflow 会议论文
2018 19TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2018-01-01
作者:  Huang, Ru;  Xia, Mengrou;  Yao, Jinye;  Wang, Boyin;  Qi, Xiao
收藏  |  浏览/下载：6/0  |  提交时间：2019/12/02
Effect of CaO additive on the interfacial reaction between the BaZrO3 refractory and titanium enrichment melt 会议论文
International Symposium on Rare Metal Technology, 2018, 2018-03-11
作者:  
收藏  |  浏览/下载：5/0  |  提交时间：2019/04/22
Interfacial reaction and mechanical properties of sic bonded with zircaloy-4 using Ni, Zr/A1 double interlayers 会议论文
41st International Conference on Advanced Ceramics and Composites, ICACC 2017, January 22, 2017 - January 27, 2017
作者:  Geng, Xin;  Wen, Guangwu;  Huang, Xiaoxiao
收藏  |  浏览/下载：1/0  |  提交时间：2019/12/31
Study on interfacial reactions in Cu/Sn-9Zn/Ni micro solder joints under temperature gradient 会议论文
2017 18TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2017-01-01
作者:  Zhao, Ning;  Wang, Mingyao;  Zhong, Yi;  Ma, Haitao;  Wang, Yunpeng
收藏  |  浏览/下载：10/0  |  提交时间：2019/12/03
Effect of intermetallic compound thickness on tensile behavior of Cu/Sn/Cu micro interconnects 会议论文
2017 18TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2017-01-01
作者:  Kuang, Jiameng;  Yang, Fan;  Huang, Mingliang
收藏  |  浏览/下载：9/0  |  提交时间：2019/12/03
Wetting and interfacial behaviors of molten Ag, Cu and Ag-28Cu on WC-8Co cemented carbide 会议论文
作者:  Fu, Hao;  Zhang, Xiangzhao;  Liu, Guiwu;  Xu, Ziwei;  Pan, Tiezheng
收藏  |  浏览/下载：11/0  |  提交时间：2019/11/26
Study on the electromigration-induced failure mechanism of Sn-3.0 Ag-0.5Cu BGA solder balls 会议论文
17th International Conference on Electronic Packaging Technology (ICEPT), Chinese Inst Elect, Elect Mfg & Packaging Technol Soc, Wuhan, PEOPLES R CHINA
作者:  Qiu, Yan;  Huang, Mingliang;  Wu, Aimin
收藏  |  浏览/下载：3/0  |  提交时间：2019/12/09
Synchrotron radiation in situ study on the solidification of Cu/Sn-58Bi/Cu solder joint under temperature gradient 会议论文
17th International Conference on Electronic Packaging Technology (ICEPT), Chinese Inst Elect, Elect Mfg & Packaging Technol Soc, Wuhan, PEOPLES R CHINA, 2016-08-16
作者:  Zhao, Ning;  Zhong, Yi;  Huang, Mingliang;  Ma, Haitao;  Dong, Wei
收藏  |  浏览/下载：8/0  |  提交时间：2019/12/09
Interfacial reaction of Ni/Sn-9Zn/Ni solder joint undergoing liquid-solid thermomigration 会议论文
17th International Conference on Electronic Packaging Technology (ICEPT), Chinese Inst Elect, Elect Mfg & Packaging Technol Soc, Wuhan, PEOPLES R CHINA, 2016-08-16
作者:  Zhao, Ning;  Deng, Jianfeng;  Zhong, Yi;  Huang, Mingliang;  Ma, Haitao
收藏  |  浏览/下载：6/0  |  提交时间：2019/12/09

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