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浏览/检索结果: 共6条，第1-6条 帮助 限定条件 内容类型：会议论文    专题：上海大学    第一署名单位    第一作者单位    通讯作者单位     已选(0)清除 条数/页：5101520253035404550556065707580859095100   排序方式：请选择作者升序作者降序题名升序题名降序发表日期升序发表日期降序提交时间升序提交时间降序 Low cycle fatigue behavior of Sn-4.0Ag-0.5Cu lead-free solder joints in different corrosive environmental conditions 会议论文 ESTC 2006 - 1st Electronics Systemintegration Technology Conference, 2006-09-05 作者:  Andersson, C.[1];  Liu, J.[2] 收藏  |  浏览/下载：3/0  |  提交时间：2019/05/10 Low cycle fatigue of Sn-based lead-free solder joints and the analysis of fatigue life prediction uncertainty 会议论文 8th IEEE CPMT Conference on High Density Microsystem Design and Packaging and Component Failure Analysis (HDP 06), 2006-06-27 作者:  Andersson, Cristina[1];  Sun, Peng[2];  Liu, Johan[3] 收藏  |  浏览/下载：4/0  |  提交时间：2019/05/10 Low cycle fatigue behavior of Sn-4.0Ag-0.5Cu lead-free solder joints in different corrosive environmental conditions 会议论文 1st Electronics Systemintegration Technology Conference 作者:  Andersson, C.[1];  Liu, J.[2] 收藏  |  浏览/下载：3/0  |  提交时间：2019/05/10 Low cycle fatigue behavior of Sn-4.0Ag-0.5Cu lead-free solder joints in different corrosive environmental conditions 会议论文 ESTC 2006: 1ST ELECTRONICS SYSTEMINTEGRATION TECHNOLOGY CONFERENCE, VOLS 1 AND 2, PROCEEDINGS, 2006-01-01 作者:  Andersson, C.[1];  Liu, J.[2] 收藏  |  浏览/下载：2/0  |  提交时间：2019/05/10 Isothermal low cycle fatigue behavior of Sn-8Zn-3Bi on single shear solder joint 会议论文 55th Electronic Components and Technology Conference, ECTC, 2005-05-31 作者:  Sun, P[1];  Andersson, C[2];  Cao, LQ[3];  Lai, ZH[4];  Cheng, ZN[5] 收藏  |  浏览/下载：2/0  |  提交时间：2019/05/10 Low cycle fatigue behavior of new heat-resistant steel HCM2S at high temperature 会议论文 The 1999 International Joint Power Generation Conference and Exhibition and ICOPE '99, 1999-07-25 作者:  Lihui, Zhu[1];  Qinxin, Zhao[2];  Haicheng, Gu[3];  Yansun, Lu[4] 收藏  |  浏览/下载：2/0  |  提交时间：2019/05/11