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浏览/检索结果: 共17条，第1-10条 帮助 限定条件 内容类型：会议论文    专题：华南理工大学    第一署名单位    第一作者单位    通讯作者单位     已选(0)清除 条数/页：5101520253035404550556065707580859095100   排序方式：请选择作者升序作者降序题名升序题名降序发表日期升序发表日期降序提交时间升序提交时间降序 Creep fracture behaviour of joints soldered by a nano-composite solder, lead-free and conventional tin-lead solders (EI收录) 会议论文 11th International Conference on Fracture 2005, ICF11, Turin, Italy, March 20, 2005 - March 25, 2005 作者:  Zhang, X.P.[1,2];  Shi, Y.W.[3];  Mai, Y.W.[1];  Shrestha, S.[4];  Dorn, L.[4] 收藏  |  浏览/下载：6/0  |  提交时间：2019/04/18 Creep  Creep resistance  Fractography  Fracture  Fracture mechanics  Lead  Microelectronics  Nanocomposites  Particle reinforced composites  Silver  Silver alloys  Soldering alloys  Textures   Processing treatment of a lead-free Sn-Ag-Cu-Bi solder by rapid laser-beam reflowing and the creep property of its soldered connection (EI收录) 会议论文 Journal of Materials Processing Technology, Singapore, Singapore, December 4, 2006 - December 6, 2006 作者:  Zhang, X.P.[1];  Yu, C.B.[1];  Zhang, Y.P.[1];  Shrestha, S.[2];  Dorn, L.[2] 收藏  |  浏览/下载：2/0  |  提交时间：2019/04/17 Creep  Laser beams  Lead  Silver  Soldering alloys  Tin alloys   Effect of dopant on microstructure and mechanical properties of Pb-free solder joints (EI收录) 会议论文 Proceedings of the Electronic Packaging Technology Conference, EPTC, Shanghai, China, August 14, 2007 - August 17, 2007 作者:  Li, G.Y.[1] 收藏  |  浏览/下载：17/0  |  提交时间：2019/04/17 Activation energy  Alloys  Brazing  Copper  Copper alloys  Electronics packaging  Lead  Mechanical properties  Semiconducting intermetallics  Silver  Silver alloys  Soldering alloys  Technology  Tin alloys  Welding   Effects of Pb content on solidification behavior and microstructure on mixed solder alloy (EI收录) 会议论文 Proceedings - 2013 14th International Conference on Electronic Packaging Technology, ICEPT 2013, Dalian, China, August 11, 2013 - August 14, 2013 作者:  Wei, Xiongfeng[1,2];  Li, Xunping[2];  Zhoubin[2];  Wei, Guoqiang[1] 收藏  |  浏览/下载：8/0  |  提交时间：2019/04/15 Alloys  Electronics packaging  Eutectics  Lead  Microstructural evolution  Microstructure  Phase diagrams  Silver  Silver alloys  Soldering  Soldering alloys  Solidification  Tin alloys   Characterization of TiC/Ti5Si3 in-situ synthesis composite materials on Ti-5Al-2.5Sn by argon tungsten-arc welding deposition (EI收录) 会议论文 Applied Mechanics and Materials, Shenyang, Liaoning, China, September 7, 2012 - September 9, 2012 作者:  Yan, Wenqing[1,2];  Dai, Le[3];  Gui, Chibin[2,4] 收藏  |  浏览/下载：2/0  |  提交时间：2019/04/15 Composite materials  Deposits  Electric arc welding  Microstructure  Scanning electron microscopy  Silicon  Tin  Titanium alloys  Tungsten  X ray analysis  X ray diffraction   Influence of soldering temperature and dwelling time on morphological evolution of Cu6Sn5 intermetallic compound at the Sn-3.0Ag-0.5Cu/Cu int (EI收录) 会议论文 ICEPT-HDP 2012 Proceedings - 2012 13th International Conference on Electronic Packaging Technology and High Density Packaging, Guilin, China, August 13, 2012 - August 16, 2012 作者:  Xu, Guang-Sui[1];  Zeng, Jing-Bo[1];  Zhou, Min-Bo[1];  Cao, Shan-Shan[1];  Ma, Xiao[1] 收藏  |  浏览/下载：5/0  |  提交时间：2019/04/15 Electronics packaging  Housing  Soldering alloys  Tin   Effects of Sb addition on grain ripening growth at interface of Sn-Ag-Cu-xSb/Cu in wetting reactions (EI收录) 会议论文 ICEPT-HDP 2012 Proceedings - 2012 13th International Conference on Electronic Packaging Technology and High Density Packaging, Guilin, China, August 13, 2012 - August 16, 2012 作者:   收藏  |  浏览/下载：2/0  |  提交时间：2019/04/15 Antimony  Copper  Copper compounds  Electronics packaging  Grain growth  Grain size and shape  Microstructure  Molluscs  Morphology  Shellfish  Silver  Soldering alloys  Tin alloys   Influence of heat treatment on the structure and magnetic properties of Gd5Sn4 alloy for magnetic refrigeration (EI收录) 会议论文 TMS Annual Meeting, San Diego, CA, United states, February 27, 2011 - March 3, 2011 作者:   收藏  |  浏览/下载：1/0  |  提交时间：2019/04/15 Alloys  Annealing  Antiferromagnetism  Crystal structure  Functional electric stimulation  Gadolinium  Magnetic properties  Magnetic refrigeration  Phase transitions  Refrigeration  Tin   Investigation on microstructures and properties of low Ag content lead-free solder alloy (EI收录) 会议论文 ICEPT-HDP 2011 Proceedings - 2011 International Conference on Electronic Packaging Technology and High Density Packaging, Shanghai, China, August 8, 2011 - August 11, 2011 作者:   收藏  |  浏览/下载：0/0  |  提交时间：2019/04/15 Alloys  Cerium alloys  Dissolution  Electronics packaging  Eutectics  Microstructure  Packaging  Tin  Wetting   Crystal structure and magnetic properties of R5Sn4 alloys, where R is Tb, Dy, Ho, and Er (EI收录) 会议论文 Journal of Applied Physics 作者:   收藏  |  浏览/下载：1/0  |  提交时间：2019/04/15 Alloys  Antiferromagnetism  Crystal structure  Crystallography  Erbium  Germanium  Holmium  Lanthanum compounds  Magnetic properties  Paramagnetic materials  Paramagnetism  Phase transitions  Rhenium compounds  Terbium alloys  Tin