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| A novel graphene oxide millisphere / epoxy resin composite with Enhanced Thermal Conductivit 会议论文
上海, 2018
作者: Chen Li; Xiaoliang Zeng; Deliang Zhu; Rong Sun; Jianbin Xu
  收藏 | 浏览/下载：28/0 | 提交时间：2019/01/31 |
| Preparation and characterization of the double-side adhesive tape with reactive properties and high thermal conductivity for electronic packaging 会议论文
上海, 2018
作者: Chang Hao; Zhang Baotan; Sun Rong
收藏 | 浏览/下载：33/0 | 提交时间：2019/01/31 |
| Facile Synthesis of Silver Nanoparticles DecoratedBoron Nitride Nanotube Hybrids 会议论文
上海, 2018
作者: Chenjie Fu; Xiaoliang Zeng; Rong Sun; Jian-Bin Xu; Ching-Ping Wong
收藏 | 浏览/下载：19/0 | 提交时间：2019/01/31 |
| The Preparation of SiO2@BN/epoxy composites with high thermal conductivity and excellent thermo-mechanical property 会议论文
Harbin, China
作者: Yuan Gao; Pengli Zhu; Gang Lia; Rong Sun; Chingping Wong
收藏 | 浏览/下载：30/0 | 提交时间：2018/02/02 |
| Liquid Epoxy Molding Compound with High Glass Transition Temperature and High Thermal Conductivity 会议论文
Harbin, China
作者: Jinze Li; Baotan Zhang; Pengli Zhu; Gang Li; Rong Sun
收藏 | 浏览/下载：18/0 | 提交时间：2018/02/02 |
| Silver Nanoparticle deposited Boron Nitride Nanosheet/Nanofrbrillated Cellulose Composites with Enhanced Thermal Conductivity 会议论文
Harbin, China
作者: Jiajia Sun; b Xiaoliang Zeng; Rong Sun; Jian-bin Xu; Ching-ping Wong
收藏 | 浏览/下载：22/0 | 提交时间：2018/02/02 |
| Oxidation Resistant core-shell Cu@SiO2 Nanowires for Composites with High Dielectric Performance 会议论文
The 17th International Conference on electronic packing Technology (ICEPT 2016), Changsha,China
作者: Yanbin Shen; Chengliang Li; Suibin Luo; Shuhui Yu; Rong Sun
收藏 | 浏览/下载：15/0 | 提交时间：2017/01/15 |
| Enhancement of thermal conductivity of phase change materials by 3D graphene @ Al2O3 foams 会议论文
The 17th International Conference on electronic packing Technology (ICEPT 2017), Wuhan,China
作者: Yaqiang Ji; Haoran Wen; Kai Zhang; Matthew M.F. Yuen; Xian-Zhu Fu
收藏 | 浏览/下载：18/0 | 提交时间：2017/01/15 |
| Low Melting Alloy Composites as Thermal Interface Materials with Low Thermal Resistance 会议论文
The 17th International Conference on electronic packing Technology (ICEPT 2016), Changsha,China
作者: Hao-Ren Wen; Ya-Qiang Ji; Matthew M.F. Yuen; Xian-Zhu Fu; Rong Song
收藏 | 浏览/下载：14/0 | 提交时间：2017/01/15 |
| Fabricating Photosensitive Polymer Insulation Layer by Spin-coating for Through Silicon Vias 会议论文
The 17th International Conference on electronic packing Technology (ICEPT 2016), Changsha,China
作者: Qiang Liu; Guoping Zhang; Rong Sun; S. W. Ricky Lee; C. P. Wong
收藏 | 浏览/下载：24/0 | 提交时间：2017/01/15 |
